WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand. New for 2024, EDI CON Educational Days will …
Join us for an in-depth exploration of our advanced NVH (Noise, vibration, and harshness) solutions. This webinar will showcase Ansys's advanced technologies and tools to help engineers tackle complex NVH challenges quickly and precisely. TIME: AUGUST 21, 2024 11:00 AM - 12:00 PM (EDT) Venue: Virtual Overview Join us for an in-depth exploration of our …
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Join us as we delve into the simulation of the dark count rate (DCR) in silicon SPADs using Ansys Lumerical CHARGE. Participants will learn about the workflow for simulating the …
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Synopsys Webinar | Thursday, August 22, 2024 | 10:00 - 10:40 a.m. PT Join us for an exclusive Synopsys Cloud webinar highlighting the benefits of license management automation. Synopsys Cloud …
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Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
Hot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is a hybrid conference. You may register to attend Virtually or In-Person. The In-Person conference is held at Memorial Auditorium, Stanford University. Tutorials: Sunday, August 25 …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Share Your Story Are you driving design change? Do you think you have successfully overcome challenges that could impact the electronics revolution? CadenceLIVE is here to share your story. Come show your expertise, share and provide professional tips to help engineers solve the complexities and challenges they face today. CadenceLIVE China 2024 China User Conference …
Focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. imec Philippe Soussan, Strategic Development Director will give a presentation About Join the online industry meeting focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. This event brings together industry leaders and innovators from across the PIC …
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Description The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 countries including China, Australia, and Canada came. Other countries represented were Egypt, France, Germany, and India. Iran, Italy, Japan, Korea, and Malaysia were also among …
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge they deserve. TIME: August 28, 2024 12 PM EDT / 9 AM PT Venue: Virtual Overview Imagine designing the next generation of consumer electronics, smart …
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The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated circuits. This conference will have highly technical content, focusing on the practical aspects of design and verification techniques and their use in cutting-edge projects. The …
