Make plans to attend and learn about latest insights, and breakthroughs in San Diego this August Conferences and Courses 18 - 22 August 2024 | Exhibition 20 - 22 August 2024 Join leading researchers and scientists as they contribute to advancements in optical engineering, nanotechnology, quantum science, and organic photonics. Meet face-to-face with premier researchers …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
Continue reading "Webinar: Advanced CMOS/FinFET Fabrication"
Join us for an in-depth, hands-on workshop on Electromagnetic Compatibility (EMC) simulation, designed to help engineers integrate powerful simulation tools into their workflow for improved product design and regulatory compliance. …
Continue reading "Webinar: Hands On Session: Mastering EMC Simulations for Electronic Designs"
Learn how to design lighter, stronger, and more efficient structures using advanced optimization techniques. Ideal for teams aiming to excel in engineering competitions, this webinar will equip teams with the …
Continue reading "Webinar: Topology Optimization Tips for Student Teams"
Improve your student team’s use of CFD by learning best practices in properly setting up, running, and validating results and learning common mistakes made in CFD for your team to …
Continue reading "Webinar: CFD Basics and Best Practices for Student Teams"
Join your fellow engineers and the Cadence Cloud team for an educational and networking event focused on developing a secure and scalable electronic design flow in the cloud. All attendees will receive a giveaway and a chance to win raffle prizes. DATE: August 20, 2024 TIME: 10:00am - 3:00pm PDT LOCATION: Cadence HQ | 2655 Seely Avenue San Jose, CA, 95134 | Building …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand. New for 2024, EDI CON Educational Days will …
Join us for an in-depth exploration of our advanced NVH (Noise, vibration, and harshness) solutions. This webinar will showcase Ansys's advanced technologies and tools to help engineers tackle complex NVH …
Continue reading "Webinar: Optimizing NVH Performance with Ansys’ Advanced Solutions"
Join us as we delve into the simulation of the dark count rate (DCR) in silicon SPADs using Ansys Lumerical CHARGE. Participants will learn about the workflow for simulating the …
Continue reading "Webinar: Simulating Dark Count Rate in Single Photon Avalanche Detectors (SPADs)"
Synopsys Webinar | Thursday, August 22, 2024 | 10:00 - 10:40 a.m. PT Join us for an exclusive Synopsys Cloud webinar highlighting the benefits of license management automation. Synopsys Cloud …
Continue reading "Webinar: Unlock Seamless EDA License Management On-Prem or In the Cloud"
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
Hot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is a hybrid conference. You may register to attend Virtually or In-Person. The In-Person conference is held at Memorial Auditorium, Stanford University. Tutorials: Sunday, August 25 …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Share Your Story Are you driving design change? Do you think you have successfully overcome challenges that could impact the electronics revolution? CadenceLIVE is here to share your story. Come …
Focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. imec Philippe Soussan, Strategic Development Director will give a presentation About Join the online industry meeting focused …
Continue reading "Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing"
Description The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 …
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge …
Continue reading "Webinar: Smart Product Innovation Just Got Easier"
The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …
About GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
On behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on …
The Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI. The event features themed pavilions and innovation zones dedicated to …
Join us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn This webinar will cover the top software updates in Fluent, including: Fluent Web Interface: Launched in 2024 R1, updates to the web-based Fluent interface include limited model …
Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, 2024 11:00 AM - 12:00 PM (EDT) Venue: Virtual Overview In 2024 R2, updates to the Fluent GPU solver include AMD GPU card support, new …
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Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
Continue reading "Webinar: Transforming Physics Simulations with Ansys and Microsoft"
Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML techniques in this upcoming webinar. TIME: September 5, 2024 Venue: Virtual Overview Ansys launched Ansys 2024 R2, which extends its digital twin offering in multiple …
Continue reading "Ansys 2024 R2: Ansys Digital Twin What’s New"
Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and manufacture. Date: Thursday, September 5, 2024 Time: 15:00 BST, 16:00 CEST, 10:00 EDT Venue: Online Questions Should you have any questions please contact uk-marketing@ansys.com About this …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these applications must be efficient to deliver high levels of performance within …
