Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Description The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 countries including China, Australia, and Canada came. Other countries represented were Egypt, France, Germany, and India. Iran, Italy, Japan, Korea, and Malaysia were also among …
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge they deserve. TIME: August 28, 2024 12 PM EDT / 9 AM PT Venue: Virtual Overview Imagine designing the next generation of consumer electronics, smart …
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The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated circuits. This conference will have highly technical content, focusing on the practical aspects of design and verification techniques and their use in cutting-edge projects. The …
About GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable us to design the essential chips the world relies on to live, work, and connect. GTS 2024 Highlights This …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
On behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on a summer’s evening The conference presents a unique forum to promote the exchange of technical and scientific information across the academic and industrial sectors in …
The Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI. The event features themed pavilions and innovation zones dedicated to …
Join us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn This webinar will cover the top software updates in Fluent, including: Fluent Web Interface: Launched in 2024 R1, updates to the web-based Fluent interface include limited model …
Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
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Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
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Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML …
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Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with …
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ChipQuest Webinar Join us for an exclusive 1-hour webinar designed for HR and Learning & Development professionals in the US semiconductor industry. This event will delve into the pressing workforce …
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Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read …
The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are …
Welcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in …
Improving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange …
Whether you are a systems engineer, product manager, or technical professional, this panel will provide valuable knowledge and insights to garner the power of MBSE in your organization. Join us …
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