Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Following up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the gap between theoretical concepts and real-world applications, providing participants with actionable insights and strategies to successfully develop and integrate digital twins into their operations. Further …
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IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM …
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Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). REGISTER HERE
Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology. Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia). …
