Webinar: IC Packaging Technology
OnlineIntegrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Loading view.
IOTE Expo China 2024
Shenzhen World Exhibiton & Convention Center 福海街道展城路1号 邮政编码, Shenzhen, Guangdong Province, ChinaDescription The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 countries including China, Australia, and Canada came. Other countries represented were Egypt, France, Germany, and India. Iran, Italy, Japan, Korea, and Malaysia were also among …
DVCon Japan 2024
Shinagawa, Tokyo, Japan Shinagawa, Tokyo, JapanThe Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …
GlobalFoundries Technology Summit (GTS) North America 2024
Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United StatesAbout GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable us to design the essential chips the world relies on to live, work, and connect. GTS 2024 Highlights This …
Continue reading "GlobalFoundries Technology Summit (GTS) North America 2024"
Advanced CMOS/FinFET Fabrication
SingaporeSemiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
CHoPS 2024 (11th International Conference on Conveying and Handling of Particulate Solids)
Edinburgh, Scotland Edinburgh, Scotland, United KingdomOn behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on a summer’s evening The conference presents a unique forum to promote the exchange of technical and scientific information across the academic and industrial sectors in …
SEMICON Taiwan 2024
Taipei, Taiwan Taipei, TaiwanThe Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI. The event features themed pavilions and innovation zones dedicated to …
Ansys 2024 R2: Ansys Fluent What’s New
OnlineJoin us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn This webinar will cover the top software updates in Fluent, including: Fluent Web Interface: Launched in 2024 R1, updates to the web-based Fluent interface include limited model …
Ansys 2024 R2: Ansys Fluent GPU Solver What’s New
OnlineCheck out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
Continue reading "Ansys 2024 R2: Ansys Fluent GPU Solver What’s New"
Webinar: Transforming Physics Simulations with Ansys and Microsoft
Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
Continue reading "Webinar: Transforming Physics Simulations with Ansys and Microsoft"
Ansys 2024 R2: Ansys Digital Twin What’s New
Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML …
Continue reading "Ansys 2024 R2: Ansys Digital Twin What’s New"
Webinar: Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and …
Synopsys Processor IP Summit 2024
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with …
Continue reading "Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain"
Webinar: Workforce Armageddon is here. Will your fab survive? Or thrive?
ChipQuest Webinar Join us for an exclusive 1-hour webinar designed for HR and Learning & Development professionals in the US semiconductor industry. This event will delve into the pressing workforce …
Continue reading "Webinar: Workforce Armageddon is here. Will your fab survive? Or thrive?"
Packaging Failure and Yield Analysis
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
MLCAD Symposium 2024
Snowbird, Utah 9385 Snowbird Center Trail, Snowbird, UT, United States6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read …
AI Hardware & Edge AI Summit 2024
Signia by Hilton San Jose 170 S Market St, San Jose, CA, United StatesThe AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are …
DVCon Taiwan
Hsinchu, Taiwan Hsinchu, TaiwanWelcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in …
COMVEC 2024
Schaumburg, Illinois Schaumburg, IL, United StatesImproving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange …
Webinar: Navigating the Details of MBSE: A Technical Panel Discussion II
OnlineWhether you are a systems engineer, product manager, or technical professional, this panel will provide valuable knowledge and insights to garner the power of MBSE in your organization. Join us …
Continue reading "Webinar: Navigating the Details of MBSE: A Technical Panel Discussion II"