On behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on …
The Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event …
Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
Continue reading "Ansys 2024 R2: Ansys Fluent GPU Solver What’s New"
Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
Continue reading "Webinar: Transforming Physics Simulations with Ansys and Microsoft"
Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML …
Continue reading "Ansys 2024 R2: Ansys Digital Twin What’s New"
Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with ISO26262 when going from chip to vehicle system. TIME: SEPTEMBER 5, 2024 9:30 AM – 4:30 PM CET Venue: Virtual Overview This course will combine lectures …
Continue reading "Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain"
ChipQuest Webinar Join us for an exclusive 1-hour webinar designed for HR and Learning & Development professionals in the US semiconductor industry. This event will delve into the pressing workforce challenges faced by the semiconductor industry and explore innovative solutions for training and development. What is The Semiconductor Workforce Armageddon? Massive expansion across the industry …
Continue reading "Webinar: Workforce Armageddon is here. Will your fab survive? Or thrive?"
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read more. Journal special issue: Following MLCAD 2024, you will be invited to submit an expanded version. Read more. Open peer review: MLCAD will be using OpenReview starting this year. Read …
The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are fast, affordable, and efficient. Whether it’s forging new partnerships, staying ahead of the ever-changing semi-conductor landscape, learning how to build, train, and deploy efficient systems, …
Welcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in Taiwan. The 1st DVCon has been held successfully in 2023. DVCon Taiwan 2024 will be held at Amazing Hall, with RISC-V Taipei Day on September …
Improving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange ideas, get up to date on research and technology, and tackle challenges — so the world can continue to depend on us. SAE International’s COMVEC™ …
Whether you are a systems engineer, product manager, or technical professional, this panel will provide valuable knowledge and insights to garner the power of MBSE in your organization. Join us for an engaging and informative session as we delve into the future of systems engineering through the lens of MBSE. TIME: September 10, 2024 9 …
Continue reading "Webinar: Navigating the Details of MBSE: A Technical Panel Discussion II"
This webinar explores the different innovations and demonstrates how optiSLang will ease the multiphysics design optimization process for enterprise and academic users. The new optiSLang 2024 R2 release adds new multiphysics capabilities to Ansys' top-tier solvers. TIME: September 10, 2024 11:00 AM EDT Venue: Virtual Overview Discover the latest innovations in Ansys optiSLang 2024 R2. …
Continue reading "Ansys 2024 R2: Ansys optiSLang What’s New"
Join your data & analytics peers serving the Financial Services industries as you discover the latest trends and challenges facing your role. NEW THIS YEAR Receive access to curated content to optimize …
Continue reading "CDAO Financial Services & Insurance UK 2024"
Please save the date for India’s premier semiconductor event, the inaugural SEMICON India 2024, September 11-13, in New Delhi. Co-located with electronica India and productronica India, the exhibition and conference will feature hallmark SEMICON networking opportunities and presentations by thought leaders from across the global semiconductor design and manufacturing supply chain. The co-location replicates the …
Join us for this webinar to discover all the new features in Ansys Rocky's 2024 R2 release, including Rocky-Mechanical coupling enhancements, transient point cloud support, and pre and post-processing with …
