EMC Fest 2024

Embassy Suites by Hilton Detroit Livonia Novi 19525 Victor Pkwy, Livonia, MI, United States

2024 Speakers:  Doug Smith and Ken Wyatt Doug Smith Topics: Resonant Structures in PCBs and Systems (Smith) Resonances in electronic systems are responsible for both EMC related failures and system …

Mastering the Porting of Code to RISC-V Architecture

ACL Digital brings to you an exciting webinar series covering all aspects of the RISC-V Ecosystem. Sign up for the exclusive webinar “Porting of Code to RISC-V Architecture,” on May 16, 8.30 a.m. to 9 a.m. PST. While RISC-V presents a simpler alternative to the complex ISAs of the past, its simplicity introduces its own challenges. Gain crucial insights to mitigate challenges and be future-ready.

Keysight EDA Connect Tour: Burlington

Eddie V's Restaurant 50 South Avenue, Burlington, MA, United States

As AI is redefining communication and connectivity, your ability to design, simulate, and test — using an intelligent and automated workflow — is what will set you apart. Join us for a half-day event that brings together top industry experts and innovators to explore modern RF circuit and system design, including advanced topics like phased …

test

test

xxxx

Gartner Data & Analytics Summit 2024

Tokyo, Japan Tokyo, Japan

Generating Value Together: From Data to AI to Collective Intelligence Welcome to the era of collective intelligence. Now is the time to mobilize the synergy of human expertise, data, analytics and AI to optimize business value and outcomes by making the best connected decisions. Fundamentals matter. We are always building and updating our technology, data …

Eurocrypt 2024

Kongresshaus Zurich Claridenstrasse 5, Zurich, Switzerland

Eurocrypt 2024, the 43rd Annual International Conference on the Theory and Applications of Cryptographic Techniques, will take place at Kongresshaus in Zurich, Switzerland on May 26-30, 2024. Eurocrypt 2024 is organized by …

TSMC 2024 China Technology Symposium

Shanghai International Convention Center (SHICC) No.2727, Riverside Avenue, Pudong, Shanghai, China

Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, …

Webinar: Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process

Online

Synopsys' SLM PVT Monitor (process detector, voltage monitor, temperature sensor) IP can collect voltage, temperature, and process parameters from different blocks within the IC in real time. These data can be analyzed and used to take meaningful action to optimize the performance of the chip at any stage of silicon lifecycle. This webinar focuses on …

Webinar: Shift Left in A/MS IC Design: Automation Methods for Early Layout Insights and Fast Iteration Loops

Online

Webinar Content Analog/mixed-signal IC design is a critical challenge for ASIC development with tight specifications and ambitious tapeout schedules that are not easy to meet. Many manual design steps from architecture through layout verification limit the amount of early insights and force time-consuming design iterations. In this webinar, we will give you an insight into …

SimWorld Canada Innovation Conference 2024

The Brookstreet Hotel Ottawa 525 Legget Dr., Ottawa, Ontario, Canada

Join Ansys on May 30, 2024, at the Brookstreet Hotel in Ottawa for the Ansys Canada Innovation Conference. This one-day event will blend Ansys expert-led technical sessions, highlighting workflows and solutions and engaging customer presentations demonstrating proven results. Date: Thursday, May 30, 2024 Time: 8:00 AM - 3:30 PM EDT Location: The Brookstreet Hotel Ottawa …

WEBINAR – Advanced Semiconductor Packaging: Leading Patent Owners and New Entrants

Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have …

Webinar: Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors

Online

Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT Many automotive applications require processing workloads with minimum latency and precise timing budgets.  This is especially true for safety-critical applications like adaptive cruise control and anti-lock braking, where human life may be jeopardized.  These systems require processing elements that can respond to events within specific (predictable) time …