Our Jam-Packed Annual Symposium The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of …
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams. …
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Virtual Event Oct 1st, 2024 | 8:00 AM PDT Oct 2nd, 2024 | 8:00 AM GMT+8 Memory Users Conference Advancements in memory technology are fueling rapid growth in big data …
About Rambus Design Summit Generative AI is poised to revolutionize every industry and redefine our daily lives. Realizing its full potential requires a dedicated-infrastructure spanning the latest in memory solutions …
This year's event is packed with industry-leading speakers, a top plenary and industry-focused sessions, and a dedicated Ansys LS-DYNA track. Join us to uncover what's possible through simulation. Hear from …
Edge Computing Expo arrives at the RAI, Amsterdam on 1-2 October 2024! Grab your ticket today to hear from leading experts as they explore how edge computing can enable a …
Book your conference ticket to Digital Transformation Week Europe which is set to explore what’s new and worth attention in the Digital Transformation ecosystem. Learn more: https://digitaltransformation-week.com/europe/ Join us in-person at the RAI, Amsterdam on 1-2 October 2024 to hear from over 200 inspiring industry leading speakers. Key topics explored: • Learn what’s new and worth …
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform …
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to register? Please see the Registration page. Talks from EDPS 2023 and the last 24 years of EDPS, are are available and …
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We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …
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The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on enriching their interactions with this technology. This event offers an enabling environment for the exchange of ideas, the creation of professional networks and the exploration …
Discover the Future of HyperLynx Technology: Lunch and Learn Join us to be among the first to explore HyperLynx breakthrough technologies designed to redefine user experience and boost design productivity. Released in September 2024, these innovations are tailored to address the most pressing challenges faced by design engineers, helping you stay ahead in a competitive …
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