In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly …
WHERE INNOVATION MEETS INFRASTRUCTURE Experience the world's largest gathering of data centre professionals and end-users at Data Centre World Frankfurt on 22-23 May 2024 at Messe Frankfurt. Data centres are the beating heart of the digital economy. Now it's time to take part in the event that powers the digital economy. Why Attend Data Centre World Frankfurt invites …
ASIP Designer enables the creation of custom vector DSPs for AI Wednesday, May 22, 2024 4:00 - 6:00 pm CEST / 7:00 - 9:00 am PT Case Studies accelerating AI applications using custom RISC-V based SIMD/VLIW DSPs The revolution in AI triggers an increased awareness for application-specific instruction-set processors (ASIPs). These processors implement a specialized …
In 2021 Siemens EDA released CDC Assist. CDC Assist is an ML powered feature that empowers users to configure, debug, and close CDC on designs more rapidly. Following the success of CDC Assist, Siemens introduced RDC Assist in 2023. Using the same ML technology in CDC Assist, RDC Assist dramatically improves the time and effort …
Manufacturing issues can be a big reason why your project timelines get derailed and even result in costly failures. By understanding common errors that occur while designing or creating your fabrication and assembly documentation, you can avoid making the same mistakes on future designs. With access to over 80 comprehensive Design for Test (DFT), Design …
Continue reading "Webinar: Addressing the Challenges of PCB Design for Manufacturing"
Ever wondered how light travels within a device? This Rand Simulation webinar will be your guide to understanding and designing optical lightguides using Ansys SPEOS. We'll explain the fundamentals of SPEOS and explore its capabilities for simulating light behavior in lightguides. Join us on Wednesday, May 22 at 2 PM ET and discover how we …
Continue reading "Webinar: Demystifying Light: Ansys SPEOS for Optical Lightguides"
EXPLORING OPEN COLLABORATION, INNOVATION & ENERGY TRANSITION Norris Conference Center, Houston, TX, USA | 23 May 2024 Future Digital Twin & Generative AI will explore Open Collaboration, Innovation and Energy Transition. Expert speakers will present and discuss Generative AI, Reality Capture and Digital Twins; Digital Twin and Large Language Models (LLM’s); Integrated Value Chains, Decarbonisation and Digital …
Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …
Continue reading "Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools"
This event is in-person only -- there is no support for remote participation. Agenda 9:30 – 10:00 Registration and Check-in Coffee and networking with your peers. 10:00 – 10:05 Welcome …
Be sure to register for this high tech security webinar. You’ll learn how to identify threat scenarios quickly and why a model-based, system-oriented solution is needed to protect your hardware. …
Continue reading "Webinar: 5 New Ways to Maximize Your Hardware Security Resilience"
Eurocrypt 2024, the 43rd Annual International Conference on the Theory and Applications of Cryptographic Techniques, will take place at Kongresshaus in Zurich, Switzerland on May 26-30, 2024. Eurocrypt 2024 is organized by …
Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on …
Synopsys' SLM PVT Monitor (process detector, voltage monitor, temperature sensor) IP can collect voltage, temperature, and process parameters from different blocks within the IC in real time. These data can be analyzed and used to take meaningful action to optimize the performance of the chip at any stage of silicon lifecycle. This webinar focuses on …
Continue reading "Webinar: Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process"
Webinar Content Analog/mixed-signal IC design is a critical challenge for ASIC development with tight specifications and ambitious tapeout schedules that are not easy to meet. Many manual design steps from …
Join Ansys on May 30, 2024, at the Brookstreet Hotel in Ottawa for the Ansys Canada Innovation Conference. This one-day event will blend Ansys expert-led technical sessions, highlighting workflows and …
Continue reading "SimWorld Canada Innovation Conference 2024"
Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing …
Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT Many automotive applications require processing workloads with minimum latency and precise timing budgets. This is especially true for safety-critical applications like adaptive …
The CHIPS for America Research and Development (R&D) Office and Natcast, the operator of the CHIPS for America National Semiconductor Technology Center (NSTC), will host a webinar to discuss the NSTC Roadmap, a summary of Natcast’s RFI on Prototyping Capabilities and Facilities, and additional details about the initial R&D projects announced in April. A historic …
Continue reading "CHIPS for America NSTC and Natcast May 2024 Update"
