Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …

Defect-Based Testing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …

2024 SIA Awards Dinner

Signia by Hilton San Jose 170 S Market St, San Jose, CA, United States

Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose …

SemIsrael Expo 2024

Avenue Convention Center Airport City, Israel

Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …

SEMICON Japan 2024

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 …