Samtec Advances Multi-Channel SerDes Technology with Broadcom at DesignCon

There were many announcements and significant demonstrations of new technology at the recent DesignCon. The show celebrated its 30^th anniversary this year and it has grown quite a bit. As in past years Samtec had a commanding presence at the show. There will be more about that in a moment, but first I want to focus on a substantial demo that teamed Samtec’s interconnect technology with Broadcom’s SerDes technology for the first time. I have many memories of my time at eSilicon. Some of those memories center on how difficult it was to compete with Broadcom’s SerDes. The demo at DesignCon brought together this substantial capability with Samtec’s industry-leading interconnect to open new horizons. Let’s examine how Samtec advances multi-channel SerDes technology with Broadcom at DesignCon.

Interconnect Technology

The key enabling technology from Samtec for the DesignCon demo with Broadcom was its Si-Fly® HD 224 Gbps PAM4, co-packaged and near chip capabilities. As the name implies, these products offer the system designer flexibility with either co-packaged interconnect with the chip on the same substrate or near-chip interconnect. The die and connector on substrate configuration creates the need for broader ecosystem collaboration since the silicon provider, interconnect provider and OSAT all need to work together to achieve a reliable product. Broader collaboration is a trend in advanced design styles like this.

The image at the top of this post shows what these connectors look like.

To get to high-density 224 Gbps PAM4 channel capability, the co-packaged option offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density. Samtec’s Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew. Digging a bit deeper, placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications. More information on this technology and the demo is coming.

The Demo

The demo at DesignCon showcased an evaluation platform with Broadcom’s 200 Gbps SerDes technology. The Samtec Si-Fly HD CPC on-package high-speed cable systems and OSFP front panel connectors were used for the interconnect. The Broadcom 200 Gbps chips and these connectors were attached to the package to maximizes system performance.

For those who want the details, here they are for the two demo platforms that were used.

Platform #1

• Evaluates the performance of the new Si-Fly HD cable assembly
• The 200 Gbps signal routes through 30 mm of substrate and loops back through 150 mm of Samtec Eye Speed Hyper Low Skew twinax cable
• BER is e-13, error-free. Total channel loss is 20 dB at 212.5 Gbps

Platform #2

• Mid-board to front panel and back
• 200 Gbps signal travels through Si-Fly HD cable assembly (25 cm Eye Speed Hyper Low Skew Twinax) with OSFP front panel connector
• One meter DAC cable, rated at 224G
• BER e-9, total channel loss 48 dB at 212.5 Gbps
• Performance will improve with release of 224G Flyover OSFP

A photo of the demo running live at the show is shown below. Note there is a link coming to a detailed video of this demo done live from the Samtec booth at DesignCon.

Samtec at DesignCon

As I discussed previously, Samtec has a tendency to dominate DesignCon. This year was no different. Beyond the compelling demos at the Samtec booth, Samtec products were also featured in demos with its partners throughout the show floor. In particular, there were noteworthy demos at the Rohde & Schwarz and Keysight booths.

Samtec was also quite visible in the technical program with the following contributions.

Panels

• PCI Express & PAM4: Balancing Silicon & Interconnect Interdependencies for 128 GT/s
• Expert Discussion: How Will AI Applications Affect High Speed Link Design?

Presentations

• Reduced Order Geometric Macro Model of PCB Fiberglass Spatial Variation for Skew & Impedance Prediction
• Transmitter Power Spectral Density Noise Impact for 200 Gb/s PAM 4 per Lane
• Direct to Substrate 200G-PAM4 Co-Packaged Connectors: Is it a Reality?
• Beyond 200G: Brick Walls of 400G links per Lane
• Accurate Adapter Removal in High Precision Low Loss RF Interconnect Characterization
• Determining the Requirements, Die vs Package vs Board: Multi-Level Power Distribution Network Design

To Learn More

You can learn more about Samtec’s Si-Fly HD co-packaged and near-chip systems here. You can also learn about another 224 Gbps PAM4 effort with Synopsys here. And finally, you can check out the live video of the important demo with Broadcom here.  And that’s how Samtec advances multi-channel SerDes technology with Broadcom at DesignCon.