High-speed PCB designs are complex, often requiring a team with design engineers, PCB designers and SI/PI engineers working together to produce a reliable product, delivered on time and within budget. Cadence has been offering PCB tools for many years, and they recently wrote a 10-page white paper on this topic, so I’ll share what I learned. The promise is that using early identification and resolution of SI and PI challenges will shorten the overall time to market.
The three PCB design steps are: Schematic, Layout, Post-layout and Signoff. If your EDA tool flow includes in-design analysis, then the team can find and fix SI and PI issues earlier and with more accuracy.
Collaboration across teams means that an EE can define the high-speed constraints at the schematic stage with little need for an SI expert. Layout designers use visualization tools to see SI/PI issues quickly in their tools. Handoffs between team members are made efficient by in-tool feedback.
The Power Distribution Network (PDN) can be analyzed for issues like IR drop under DC operating conditions, enabling decisions on current density and specifying copper weight and thicknesses. You can visualize DC drop analysis in Cadence tools.

During transient operation the PCB design encounters high-frequency switching currents that couple with inductance to create voltage noise. Add decoupling capacitors and minimizing inductance are ways to mitigate this noise. AC power analysis tools simulate transient responses from the PCB, along with power noise and impedance profiles so that each component has stable and clean power.

High-speed datalinks are commonly used for PCIe, Ethernet, USB and UCIe designs, so care is required to manage channel loses, via effects and pass compliance testing. Vias can add undesired discontinuities, create impedance mismatches and degrade signals from inductance and capacitance effects, cause stub resonance and even add return path discontinuities. Engineers can now design, view and validate via structures early on with the Aurora Via Wizard.

Traces at high frequencies exhibit losses from conductor resistance, dielectric absorption and the roughness of copper traces. Designers can choose low-loss dielectrics, optimize the trace geometry and maintain a continuous ground plane under signal traces to mitigate these losses. To simulate different dielectric materials the Sigrity X Topology Workbench comes into play. For SerDes interfaces there’s the Compliance Analysis tools to validate a design early, adjust signal paths and pass protocol specifications.
Designing DDR5 interfaces at multi-gigabit speeds is enabled by using Sigrity X Topology Explorer Workbench for parameter sweeps to find the best termination configuration and find optimal routing solutions while finding any timing violations. DDR memory buses can have hundreds of signals, and using Sigrity X Aurora helps to automate through impedance validation, crosstalk analysis and return path optimization.

Another high-speed design issue is Simultaneous Switching Noise (SSN), causing ground bounce, increased jitter and timing errors. Cadence has power-aware IBIS and advanced PDN analysis tools to quickly identify these vulnerabilities, provide decoupling capacitor placement and accurately simulation SSN effects. For via-to-via crosstalk issues there’s 2.5D and 3D analysis tools for via modeling, along with design recommendations for via shielding and optimized layer transitions.
Cadence Tools
The full high-speed PCB flow is covered by tools that work together from schematic to signoff: Allegro X Design Platform, Sigrity X Platform, Sigrity X Aurora Via Wizard, Sigrity X Topology Explorer Workbench, Clarity 3D.
Summary
High-speed PCB design teams can navigate successfully through the challenges of signal integrity and power integrity by using in-design analysis tools. This approach shortens time to market through tool automation, using distributed computing and making complex concepts easier to understand.
Read the complete white paper from Cadence online.
Related Blogs
- SI and PI Update from Cadence on Sigrity X
- Addressing Reliability and Safety of Power Modules for Electric Vehicles
- Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals
- Using AI in EDA for Multidisciplinary Design Analysis and Optimization
Comments
There are no comments yet.
You must register or log in to view/post comments.