Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
Counting squares is a useful tool for calculating simple resistance in wires, but falls short in reality when wires deviate from ideal. Frequently the use of RC extraction tools for determining resistance in signal lines in digital designs can be effective and straightforward. However, there are classes of nets in designs that… Read More
2015 will be remembered as the year when chip-package-system (CPS) physical co-design and electrical/thermal analysis methodologies took center stage.… Read More
DesignCon is a unique conference — its tagline is “Where the Chip meets the Board”. Held each January in Santa Clara, the conference showcases a wealth of new technologies for advanced packaging, printed circuit board fabrication, connectors, cables, and related analysis equipment (e.g, BERT, VNA, scopes). Of specific… Read More
The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More
I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More
Since power has become a critical factor in semiconductor chip design, the stress is towards decreasing supply voltage to reduce power consumption. However, the threshold voltage to switch devices cannot go down beyond a certain limit and these results in an extremely narrow margin for noise between the two. And that gets further… Read More
The power integrity (PI) of a system is an extremely important aspect to be looked at all levels – chip, package and PCB for overall reliability of the system. At the PCB level, a DC analysis, usually based on IR drop, must ensure that adequate DC voltage, satisfying all constraints of current density and temperature, is delivered… Read More
LSI Corporationstarted in 1980s and I had several encounters with it during my jobs in 1990s; not to forget the LSI chips I used to see in desktops and other electronic systems, and I’m happy to see LSI continuing today with more vigour having leadership position in storage and networking space. It provides highly reliable, high … Read More
It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More
