CadenceTECHTALK: Integrated Thermal Analysis for RF MMIC and PCB Power Applications

CadenceTECHTALK: Integrated Thermal Analysis for RF MMIC and PCB Power Applications
by Admin on 01-16-2023 at 2:07 pm

Date: Tuesday, January 24, 2023

Time: 09:00 GMT / 10:00 CET / 11:00 EET & Israel / 14:30 IST

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide

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Siemens Aspires to AI in PCB Design

Siemens Aspires to AI in PCB Design
by Bernard Murphy on 12-28-2022 at 6:00 am

PCB min

This. AI in PCB design is not a new idea. Other PCB software companies also make that claim. But when a mainstream systems technology company like Siemens talks about the subject, that is noteworthy. They already have an adaptive user interface (UI) for their mechanical modeling suite and to assist in low-code development for application… Read More


Why Use PADS Professional Premium for Electronic Design

Why Use PADS Professional Premium for Electronic Design
by Daniel Payne on 11-01-2022 at 6:00 am

PADS Designer min

My IC design career started just a few years before PADS got started in 1985 with a DOS-based tool for PCB design. A lot has changed since then, as PADS was acquired by Mentor Graphics in 2001, and continued to grow under Siemens EDA, now with four versions to choose from, where the top version is called PADS Professional Premium:

  • PADS
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Cadence TECHTALK: Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow

Cadence TECHTALK: Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow
by Admin on 10-19-2022 at 2:31 pm

Date: Thursday, November 10, 2022

Time: 9:00am – 10:00am (PDT)

RF/microwave IP, developed in a specialized design environment, must be transferred to a PCB layout editor where manufacturing constraints, design rule checking (DRC), layout vs. schematic (LVS), and corporate-approved components can be applied and integrated… Read More


Webinar: Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Webinar: Integrated Thermal Analysis for RF MMIC and PCB Power Applications
by Admin on 08-29-2022 at 2:45 pm

Time: 9:00am – 10:00am (PT)

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and

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Webinar: Using Statistical Methods to Assess PCB Solder Failure Modes

Webinar: Using Statistical Methods to Assess PCB Solder Failure Modes
by Admin on 08-22-2022 at 3:01 pm

Learn about that statistical methods used to track PCB field failures and how these methods are used in corresponding failure simulations during this upcoming webinar.

TIME:

SEPTEMBER 21, 2022
11 AM EDT / 4 PM BST / 8:30 PM IST

About This Webinar

Printed Circuit Boards (PCBs) are susceptible to several known solder failure modes

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Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT

Automate PCB Thermal Simulation Workflow with Ansys Icepak and PyAEDT
by Admin on 08-22-2022 at 2:56 pm

Customer Spotlight Webinar with Webasto

We’ll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs.

TIME:
SEPTEMBER 21, 2022
9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET 

About this

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Preserving IP When Working with Contract Manufacturers and PCB Designers

Preserving IP When Working with Contract Manufacturers and PCB Designers
by Admin on 07-08-2022 at 2:22 pm

Time: 9:00 am PDT | 12:00 pm EDT | 18:00 CEST

Reliance on partners is critical for the success of more complex designs. Working with PCB designers, PCB manufacturers, and Contract manufacturers means trusting your IP with many stakeholders.

Join this webinar to learn best practices and some product-level implementations to

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