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Intelligent Cross-Platform Workflows for RF PCB Integration
Overview
RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times
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Boost LPDDR5 Verification from IP to System-Level
Overview
Low power DRAM is being adopted in a wide array of markets, including automotive, PCs and networking systems built for 5G and AI applications. The specification complexity is increasing to meet higher bandwidth, better performance and extended latencies
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Register For This Web Seminar
Overview
The circuit speeds of digital designs have been on an “up and to the right” trend from the earliest ICs, and there is no question that it will continue. As speeds increase, so to the problems, especially
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Double data rate (DDR) synchronous dynamic random-access memory (SDRAM) is the common type of memory used as RAM for almost every modern processor. With DDR memory interface voltages decreasing, speeds increasing, and timing/power budgets being squeezed, design qualification using the latest memory interfaces is no small… Read More
February 20, 2020
12:00 PM (EST)
PCBs can be difficult to model for mechanical analysis because they have a large number of components of various materials all contained within small dimensions. To overcome these challenges, PCB models are often simplified for analysis. However, modeling with too few details can
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The last session I attended at DesignCon 2020 wasn’t a session at all. Rather it was an interactive discussion with Todd Westerhoff, product manager for electronic board systems at Mentor Graphics. Todd made some observations about the way high-performance PCBs are designed today and perhaps the way they should be designed. … Read More
The need for full wave EM solvers has been creeping into digital design for some time. Higher operating frequencies – like those found in 112G links, lower noise margins – caused by multi level signaling such as in PAM-4, and increasing design complexity – as seen in RDL structures, interposers, advanced connector… Read More
This week Cadence introduced Legato™ Reliability Solution, intended to address increased challenges in designing high-reliability analog and mixed-signal ICs for automotive, industrial, aerospace and defense applications.… Read More
Chip designers are familiar with the additional physical design checking requirements that were incorporated into flows at advanced process nodes. With the introduction of optical correction and inverse lithography technology applied during mask data generation, and with the extension of a 193nm exposure source to finer… Read More
Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More
