SiC TargetedApplication Arm 2 (1)
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Did we forget non-volatile memory?

Did we forget non-volatile memory?
by Don Dingee on 10-15-2014 at 7:00 pm

In our rush to shrink SoC nodes more and more to achieve better performance and more complex devices, we may have forgotten a passenger in the back seat: non-volatile memory. There has been little discussion of this in the pages of SemiWiki until now. Let’s give it a closer look.

Embedded flash has usually been associated with microcontrollers,… Read More


GPU Benchmarks? Try to See the Complete Picture…

GPU Benchmarks? Try to See the Complete Picture…
by Eric Esteve on 10-15-2014 at 3:29 am

We all know benchmarks, but do we really understand benchmark results? Benchmark users should always look beyond the simple score when making in-depth technical analysis and request to see all the facts. There are many graphics benchmarks to choose from but let’s name today these three below:

3DMark Ice Stormfrom Futuremark… Read More


How ST Designs with Layout Dependent Effects (LDE)

How ST Designs with Layout Dependent Effects (LDE)
by Daniel Payne on 10-15-2014 at 12:00 am

I first visited STat their Agrate, Italy site where Flash memory development is done. At DACthis year Antonio Bogani talked about how ST designs with LDE while using EDA tools and a PDK (Process Design Kit) from Cadence. They recorded the 17 minute presentation, and you can view it herewithout having to register. Antonio’s… Read More


Proving the Power of Virtual Fabrication

Proving the Power of Virtual Fabrication
by Pawan Fangaria on 10-13-2014 at 7:00 am

There are many facets of our lives that are being driven to a more virtual method of doing things. This is largely due to issues such as scaling due to whatever reason – technical, business, economic. Let’s look at some general cases: In yesteryears people used to travel all the way for face-to-face meetings; today virtual meetings… Read More


WTL Leverage FDSOI to Achieve Both Low Power AND High Speed

WTL Leverage FDSOI to Achieve Both Low Power AND High Speed
by Eric Esteve on 10-07-2014 at 11:46 am

In fact, this is the title of a presentation given by Pete Foley during FD-SOI Forum 2014 held in Shanghai, a couple of weeks ago. What is nice with clever people like Pete Foley is that they get the point, and get it quickly. Getting the point is to insert AND in capital in the title, as using FD-SOI technology allows to benefit from low-power… Read More


Agile IC Development

Agile IC Development
by Paul McLellan on 10-01-2014 at 7:00 am

If you have been involved in software development you have probably heard of the “waterfall” development methodology. This is the approach whereby a complete specification of the software is developed before a single line of code is written. Nowadays, few people develop software that way since it is too slow. And… Read More


SiC and Si Power Devices

SiC and Si Power Devices
by Daniel Payne on 09-27-2014 at 7:00 am

ICs for consumer electronics are often battery powered, which are considered low voltage designs. On the other end of the IC spectrum are high voltage devices used in many industrial applications like: automotive, aerospace, data centers, transportation and power generation. … Read More


TCAD to SPICE

TCAD to SPICE
by Paul McLellan on 09-21-2014 at 7:00 am

Power devices have historically been made from silicon (Si), which has reached the limit of electric power loss reduction. With the superior physical and electrical properties of silicon carbide (SiC), we can expect to see a significant expansion in the amount of electric power conversion of electrical equipment as well as reduced… Read More


MEMS+, Bringing MEMS into the Electronic World

MEMS+, Bringing MEMS into the Electronic World
by Paul McLellan on 09-19-2014 at 1:59 pm

One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics necessary to process the signal from the sensor and end up with something… Read More


Sidense overlays OTP on TSMC 16nm FinFET

Sidense overlays OTP on TSMC 16nm FinFET
by Don Dingee on 09-13-2014 at 7:00 am

Process shrinks, which have served us well for most of the Moore’s Law journey, are reaching their limits. For switching transistors, the biggest problems of leakage current and gate oxide vulnerability in planar MOSFETs have led the industry to new 3D microstructures such as FinFET. For non-volatile memory, the problem is generally… Read More