On June 24, 2019, Nanometrics and Rudolph Technology announced they will combine in an all-stock merger of equals transaction. The companies say the combination increases the SAM (served available market) opportunity to approximately $3B.
This article attempts to analyze the two companies in their different business segments,… Read More
The rising complexity of modern SoC designs, as enabled by progressing manufacturing technology, leads to an increasing validation challenge as the only way to manage complexity increase is by re-using more pre-designed IP blocks. These IP-blocks are provided by various suppliers such as a foundry partner, internal design… Read More
Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More
Hardware is roaring back into prominence in technology innovation, from advanced cars to robots, smart homes and smart cities, 5G communication and the burgeoning electronification of industry, medicine and utilities. While software continues to play a role, all of these capabilities depend fundamentally on advances in … Read More
I’ve been driving cars since 1978 and have even done a few DIY repairs in the garage, so I know how warm the engine compartment, transmission or exhaust system can become which makes automotive IC design rather unique in terms of the high temperature and voltage ranges that an electronic component is subjected to. Our safety… Read More
The semiconductor equipment market grew 37.3% in 2017 on the heels of capex spend by memory companies in order to increase bit capacity and move to more sophisticated products with smaller nanometer dimensions. Unfortunately these companies overspent resulting in excessive oversupply of memory chips. As memory prices started… Read More
Most of my investments are associated with large changes in the semiconductor industry. These changes create opportunities for new and disruptive technologies. I also look to find solutions that provide a compelling reason to adopt a new technology or approach. When talking about a new approach, it often takes longer to overcome… Read More
I plan to attend to the GSA European Forum in Munich (April 15-16), so I first looked at the event description and at the impressive speakers list. In such event, the goal is at 50% to listen, and 50% to network with the speakers and the other attendant. The center of gravity is clearly semiconductor, but the event involved speakers … Read More
Last week I attended the first Verification 3.0 Innovation Summit held at Levi’s Stadium in Santa Clara along with about 90 other interested engineers and former engineers (meaning marketing and sales people, like me). There was a great vibe and feel to the event as it exuded an energy level that I have not felt at an EDA event in years.… Read More
What does Qualcomm, Intel, and Facebook have in common? Well, for one thing they all bought network onchip communications (NoC) IP companies. As I have mentioned before, semiconductor IP is the foundation of the fabless semiconductor ecosystem and I believe this trend of acquisitions will continue. So, if you are going to start… Read More
