I have been observing Fractal Technologiesexhibiting at DACyear after year, and every year they have demonstrated good value added features in their tools for SoC and IP development. This year at 52[SUP]nd[/SUP] DAC Fractal’s booth number is 1110. Earlier in this year Fractal had added a new ‘Cdiff’ feature in its flagship product… Read More
For any semiconductor technology node to be adopted in actual semiconductor designs, the very first step is to have a Process Design Kit (PDK) developed for that particular technology node and qualified through several design tools used in the design flow. The development of PDK has not been easy; it’s a tedious, time consuming,… Read More
Back last October 1st was an announcement of Agile IC Methodology. As I said then:Today Sonics has launched the Agile IC Methodology along with several collaborators. The initial phase is to create a LinkedIn group to start the discussion.
See also Agile IC Development
At that point there was just an idea and a LinkedIn group. The… Read More
Coventor were in Copenhagen Denmark a few weeks ago at the Smart Systems Integration Conference to talk about MEMS and IoT entitled (take a deep breath) Towards a Lego Block Principle for Heterogonous Systems Design Including MEMS and Electronics—Choose and Put Together Fit. Since this seems to have become IoT week for me, without… Read More
Do you have one of those step-tracker things? They seem to be one of the earliest IoT devices that are actually selling in large quantities. Smartphones are also starting to contain this sort of sensor to provide similar functionality without requiring a separate device, as are smart-watches such as the Jumpy watch for kids on the… Read More
Every time I see a presentation on IoT the forecast for the number of devices in 2020 seems to go up by a few billion. But behind the hype there are clearly going to be a large number of devices on (and even in) our bodies, our homes and cars. Not to mention in factories and workplaces. IoT devices cover a wide spectrum. Realtors like to expand… Read More
The headquarters of ST Microelectronics is officially in Switzerland, but in many ways the center of gravity is in the Grenoble area. You may have heard of Crolles where ST does process development, manufacturing and more, which is about ten miles north-east of the city. As a result, along with the CEA-LETI and Grenoble Institute… Read More
A tremendous number of chips being designed for today’s products require some sort of onboard data storage. The size of these needs range from a handful of bytes, for trim and calibration storage, to something much more substantial like boot code storage. In both of these examples the storage ideally should be nonvolatile, with… Read More
As a professional conference goer I can see definite trends when it comes to topics and attendance. Thus far this year I have seen a double digit increase in attendance, which is great. The question is why? Why is the fabless semiconductor ecosystem leaving the safety of their cubicles and computer screens in droves to mingle amongst… Read More
On-chip variation (OCV) is a major issue in timing signoff, especially at low voltages or in 20/16/14nm processes. For example, the graph below shows a 20nm inverter. At 0.6V the inverter has a delay of 2 (nominalized) units. But due to on-chip variation this might be as low as 1.5 units or as high as 3 units, which is a difference from… Read More
