The foundry landscape is changing again and it is definitely something that should be discussed. There are some people, mostly influenced by Intel, that feel the foundry business has hit the wall at 20nm which couldn’t be further from the truth. After spending 30 years working in Silicon Valley, I have experienced a lot of change… Read More
TSMC OIP presentations available!
Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference:
- Design Reliability with Calibre YE-SmartFill and Calibre PERC (Broadcom & Mentor Graphics)
New methodologies were developed for 28nm designs using Calibre SmartFill and Calibre
TSMC projects $800 Million of 2.5/3D-IC Revenues for 2016
At TSMC’s latest earnings call held mid January 2014, an analyst asked TSMC for a revenue forecast for their emerging 2.5/3D product line. C.C. Wei, President and Co-CEO answered: “800 Million Dollars in 2016 ”. TSMC has demonstrated great vision many times before. For me, an enthusiastic supporter of this technology, this statement… Read More
Is Altera Leaving Intel for TSMC?
There is a rumor making the rounds that Altera will leave Intel and return to TSMC. Rumors are just rumors but this one certainly has legs and I will tell you why and what I would have done if I were Altera CEO John Daane. Altera is a great company, one that I have enjoyed working with over the years, but I really think they made a serious mistake… Read More
ESD at TSMC: IP Providers Will Need to Use Mentor to Check
I met with Tom Quan of TSMC and Michael Beuler-Garcia of Mentor last week. Weirdly, Mentor’s newish buildings are the old Avant! buildings where I worked for a few weeks after selling Compass Design Automation to them. Odd sort of déja vu. Historically, TSMC has operated with EDA companies in a fairly structured way: TSMC … Read More
TSMC Responds to Intel’s 14nm Density Claim!
TSMC responded to Intel’s 14nm density advantage claim in the most recent conference call. It is something I have been following closely and have written about extensively both publicly and privately. Please remember that the fabless semiconductor ecosystem is all about crowd sourcing and it is very hard to fool a crowd of semiconductor… Read More
Intel is NOT Transparent Again!
Recent headlines suggest that Intel was not transparent about some of the products they showed at the CES keynote. Intel confirmed on Friday that they used ARM-based chips for some of the products but would not say which ones. When your company’s tag line is “Intel Inside” and you hold up a product during your keynote wouldn’t… Read More
Intel Wafer Pricing Exposed!
One of the big questions on Intel’s foundry strategy is: Can they compete on wafer pricing? Fortunately there are now detailed reports that support what most of us fabless folks already know. The simple answer is no, Intel cannot compete with TSMC or Samsung on wafer pricing at 28nm, 20nm, and 14nm.
In fact, recent reports have shown… Read More
TSMC: 3D, 450mm, CoWoS and More
The first keynote at the Burlingame 3D conference was by Doug Yu of TSMC. Not surprisingly he was talking about 3D. In particular, TSMC has WLSI technology that they call CoWoS, which stands for chip-on-wafer-on-substrate which pretty much describes how it is built. This is the technology that Xilinx uses for its recently announced… Read More
QCOM delivers first TSMC 20nm mobile chips!
QCOM is now sampling the TSMC 20nm version of its market dominating Gobi LTE modem. The announcement also included a new turbo charged version of their 28nm Snapdragon 800 SoC with a Krait 450 quad core CPU and Adrino 420 GPU. Given the comparable benchmarks between the Intel 22nm SoC and the 28nm SoCs from Apple and QCOM, the new 20nm… Read More