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As Pokemon Go invades the world, let me give you a firsthand player’s description of the game and why the next generation of augmented reality apps will energize the fabless semiconductor ecosystem and greatly benefit TSMC.
While I am not a “gamer” per say, I am a technologist and am always looking for new semiconductor market drivers.… Read More
Four panelists from big-name semiconductor design companies spoke about their circuit simulation experiences at #53DAC in Austin this year, so I attended to learn more about SPICE and Fast SPICE circuit simulation. I heard from the following four companies:… Read More
At a recent outing with FPGA friends from days gone by, the long running Xilinx vs Altera debate has come to an end. The bottom line is that Xilinx has used the FUD (fear, uncertainty, and doubt) of the Intel acquisition quite effectively against Altera and is racking up 20nm and 16nm design wins at an alarming rate. It will be a while … Read More
NVIDIA has been teasing the promise of Pascal for years, but this year Pascal’s performance became much more real. With the announcement of the Tesla P100 based on Pascal, NVIDIA was able to show the neural-network world what Pascal was really capable of. However, that chip is very different from the gaming-focused Pascal chip … Read More
TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More
The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More
About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More
Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.
CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More
Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More
I have written multiple articles about this year’s SPIE Advanced Lithography Conference describing all of the progress EUV has made in the last year. Source power is improving, photoresists are getting faster, prototype pellicles are in testing, multiple sites around the world are exposing wafers by the thousands and more. … Read More
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[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)