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IEDM 2022 – TSMC 3nm

IEDM 2022 – TSMC 3nm
by Scotten Jones on 01-02-2023 at 6:00 am

TSMC CPP

TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.

When … Read More


Micron Ugly Free Fall Continues as Downcycle Shapes Come into Focus

Micron Ugly Free Fall Continues as Downcycle Shapes Come into Focus
by Robert Maire on 12-26-2022 at 6:00 am

Micron Crashing 2022

-Micron off the proverbial cliff and falling faster
-Looking at a much longer/deeper decline in memory
-Layoffs, capex cuts, slowdowns- battening down the hatches
-Micron seems to imply more of a “U” or “L” shaped downcycle

Micron’s numbers as bad as we expected And much worse than most on the

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A Five-Year Formal Celebration at Axiomise

A Five-Year Formal Celebration at Axiomise
by Daniel Nenni on 12-23-2022 at 6:00 am

DAC 2022 Axiomise

It’s been a bit more than a year since I interviewed Dr. Ashish Darbari, founder and CEO of Axiomise. I’ve been keeping an eye on Ashish and his colleagues, and I was surprised to learn that they recently celebrated their fifth anniversary as a company. I thought that this would be a good time to catch up with him to find out what’s happened… Read More


VeriSilicon’s VeriHealth Chip Design Platform for Smart Healthcare Applications

VeriSilicon’s VeriHealth Chip Design Platform for Smart Healthcare Applications
by Kalar Rajendiran on 12-13-2022 at 10:00 am

VeriHealth Showing Fall Detection

The wearables electronics market is a large and fast growing one. According to Precedence Research, the global wearable technology market is expected to grow at a compound annual growth rate of 13.89% during the forecast period 2022 to 2030. Precedence estimated the global wearable technology market size at USD 121.7 billion… Read More


Webinar: Flexible, Scalable Interconnect for AI HW System Architectures

Webinar: Flexible, Scalable Interconnect for AI HW System Architectures
by Mike Gianfagna on 12-09-2022 at 6:00 am

Webinar Flexible Scalable Interconnect for AI HW System Architectures

Building next generation systems is a real balancing act. The high-performance computing demands presented by increasing AI an ML content in systems means there are increasing challenges for power consumption, thermal load, and the never-ending appetite for faster data communications.  Power, performance, and cooling … Read More


IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
by Scotten Jones on 12-06-2022 at 10:00 am

Ann 2022 IEDM Plenary Dec. 5 Roadmap Slide

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More


Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More


Is your career at RISK without RISC-V?

Is your career at RISK without RISC-V?
by Sivakumar PR on 12-05-2022 at 6:00 am

Fig 1 1

I am delighted to share my technical insights into RISC-V in this article to inspire and prepare the next generation of chip designers for the future of the open era of computing. If you understand how we build complex electronic devices like desktops and smartphones using processors, you would be more interested in learning and… Read More


High-End Interconnect IP Forecast 2022 to 2026

High-End Interconnect IP Forecast 2022 to 2026
by Eric Esteve on 12-04-2022 at 10:00 am

TSMC Revenue by Platform 1Q22 1

The Interface IP market has grown with 21% CAGR from 2017 to 2021 and we review the part of this market restricted to the high-end of PCIe, DDR, Ethernet and D2D IP made of PHY and controller targeting the most advanced technology nodes and latest protocol release. We will show that an IP vendor focusing investment on the high-end interconnect… Read More


AMAT and Semitool Deja Vu all over again

AMAT and Semitool Deja Vu all over again
by Robert Maire on 11-24-2022 at 6:00 am

Lam SemiWiki SemiSysco

-Lam/Semisysco is a repeat of AMAT/Semitool
-Adds wet processing that larger companies lack
-Semisysco tools amazingly similar to those made by Semitool
-Lightning strikes twice for Ray Thompson

Deja Vu all over again

In a clear example of history repeating itself, Lam Research bought Semisysco, a company founded by Ray Thompson,… Read More