As architects push toward advanced nodes and increasingly demanding workloads, modern silicon design has entered an era of unprecedented complexity. A single design respin can cost millions of dollars and delay market entry. Against this backdrop, designs must be balanced for performance, bandwidth, power efficiency, security… Read More
Tuple Technologies Develops AI-powered Infrastructure at 2026 DAC
Tuple Technologies develops AI-powered infrastructure and operations platforms specifically designed for semiconductor companies. The company’s solutions help engineering organizations simplify CAD infrastructure management, optimize cloud resources, improve security and compliance, and reduce operational… Read More
DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.
Accellera Systems Initiative invites the design and verification community to join us at the 2026 Design Automation Conference for a focused technical luncheon, “Embracing AI for Advanced Design and Verification,” on Tuesday, July 28, from 12:30–1:45 p.m. at the Long Beach Convention Center, Meeting Room 104C.
Artificial… Read More
Podcast EP355: An Overview of the Q126 Electronic Design Market Data Report with Wally Rhines
Daniel is joined by Wally Rhines, CEO of Silvaco to discuss the Electronic Design Market Data report that was just released. Wally is the industry coordinator for the EDA data collection program called EDMD. SEMI and the Electronic System Design Alliance collect data from almost all of the electronic design automation companies… Read More
AI Driven Semiconductor Systems
AI-driven semiconductor systems are the next major transformation in chip design and manufacturing. The central idea is that semiconductor workflows are becoming too complex, too data-intensive, and too time-sensitive to be managed only through traditional human-driven engineering processes. Modern chips now involve… Read More
Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More
SemiAnalysis EDA Market Primer – Market Dynamics, Cadence, Synopsys, Siemens, China EDA Rise
Electronic Design Automation, or EDA, is the software infrastructure that transforms a hardware specification into a manufacturable integrated circuit. At advanced process nodes, the problem is no longer simply drawing transistors or connecting gates. A modern system-on-chip contains billions of standard cells, hundreds… Read More
WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads
In this webinar, Google Cloud and NetApp explore how semiconductor companies can address the growing infrastructure demands of modern Electronic Design Automation (EDA) workflows. As process technologies continue to advance and chip designs become increasingly complex, engineering teams require scalable, high-performance… Read More
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26
I recently covered what Samtec was doing at DesignCon 26. Samtec has a tendency to dominate any show it attends in multiple dimensions. The prior post focused on the company’s contributions to the technical agenda and the high-profile experts in attendance. While all that is interesting and valuable, attending a large show like… Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk
As semiconductor complexity accelerates across AI, automotive, and edge computing markets, SoC architecture has become a critical determinant of commercial success. Modern silicon programs must simultaneously achieve aggressive performance-per-watt targets, support evolving workloads, and maintain manageable development… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging