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Selecting an ASIC package

Selecting an ASIC package
by Daniel Nenni on 05-29-2019 at 10:00 am

Semiconductor chip package technologies have evolved throughout the years to the point where hundreds of package types are available today. 

Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However,… Read More


Semiconductor IP Security Issues

Semiconductor IP Security Issues
by Daniel Payne on 05-26-2019 at 4:46 pm

Every morning I read the headlines from SemiWiki, CNN, LinkedIn and my Twitter feed, and it seems like every week that I read about another security breach that makes me wonder if anything online is secure. Companies try to harden their web sites, IT infrastructure and even their electronic products from being exploited or tampered… Read More


400G Ethernet test chip tapes-out at 7nm from eSilicon

400G Ethernet test chip tapes-out at 7nm from eSilicon
by Tom Simon on 05-24-2019 at 10:00 am

Since the beginning of May eSilicon has announced the tape-out of three TSMC 7nm test chips. The first of these, a 7nm 400G Ethernet Gearbox/Retimer design, caught my eye and I followed up with Hugh Durdan, their vice president of strategy and products, to learn more about it. Rather than just respin their 56G SerDes, they decided… Read More


Chips are the bleeding edge of China trade war Recovery

Chips are the bleeding edge of China trade war Recovery
by Robert Maire on 05-17-2019 at 7:00 am

Last week we warned of a further down leg due to China trade. We were surprised how quickly our prediction came true as it appears we are now in the midst of giving back all the upside built in to stocks based on a peaceful resolution of the trade conflict which obviously isn’t happening.

Many of the semi stocks we cover were down… Read More


Trade war shifts electronics production

Trade war shifts electronics production
by Bill Jewell on 05-14-2019 at 7:00 am

The U.S. is showing steady growth in electronics production. Three-month-average change versus a year ago (3/12) in March 2019 was 6.2%, the 12[SUP]th[/SUP] consecutive month of growth above 5%. China electronics production is decelerating, with March 2019 3/12 growth of 8.2%, similar to 8.3% in February. This marks the first… Read More


Chip Equip Trade War Collateral Damage

Chip Equip Trade War Collateral Damage
by Robert Maire on 05-13-2019 at 7:00 am

We have been very vocal and perhaps the first to warn of the risks to the semiconductor and semiconductor equipment industry from the China trade war with the US. It seems that the war is now fully upon us with the imposition of 25% tariffs by the US and promised retribution by China. The semiconductor industry is at the leading edge … Read More


ESD Alliance CEO Outlook Features Powerhouse Lineup

ESD Alliance CEO Outlook Features Powerhouse Lineup
by Bob Smith on 05-09-2019 at 2:00 pm

Just two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.

That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator. Panelists… Read More


Bottom of a Semiconductor Canoe Cycle Shape

Bottom of a Semiconductor Canoe Cycle Shape
by Robert Maire on 05-09-2019 at 12:00 pm

Nice numbers despite the cycle bottom
KLA put up EPS of $1.80 versus street of $1.67 on revenues of $1.097B versus street of $1.08B. However guidance was weaker than the street was hoping for with a range of $1.21B to $1.29B in revenues generating between $1.55 and $1.85 in non GAAP EPS. This is compared to current street estimates … Read More


eSilicon ASICs all in the Google Cloud

eSilicon ASICs all in the Google Cloud
by Daniel Nenni on 05-08-2019 at 12:00 pm

Having just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud and a lot more … Read More


TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More