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The media already has Apple and Intel in talks to make the A11 SoC in 2018 as a result of the recent Intel/ARM IP licensing deal. This is probably one of the funnier media bumbles I have read in a while so let’s talk about it in a little more detail.
“According to Nikkei Asian Review, Intel is now perfectly poised to give TSMC a good run for… Read More
MediaTek (MTK) recently made the news for announcing their first leading edge SoC (Helio X30), a 32% increase in quarter over quarter sales, and an expected 30% increase for the year. Both of which deserve a closer look as we move into the second half of 2016 which should be very strong for MTK TSMC, and the fabless semiconductor ecosystem.… Read More
TSMC is the bellwether for not only the foundry business, since they are the dominant player, but also the semiconductor industry as a whole. You could also argue that TSMC is a sneak peek into the world economy since they build capacity based on their customer’s forecasts and the world now revolves around semiconductors.
The other… Read More
As Pokemon Go invades the world, let me give you a firsthand player’s description of the game and why the next generation of augmented reality apps will energize the fabless semiconductor ecosystem and greatly benefit TSMC.
While I am not a “gamer” per say, I am a technologist and am always looking for new semiconductor market drivers.… Read More
NVIDIA has been teasing the promise of Pascal for years, but this year Pascal’s performance became much more real. With the announcement of the Tesla P100 based on Pascal, NVIDIA was able to show the neural-network world what Pascal was really capable of. However, that chip is very different from the gaming-focused Pascal chip … Read More
TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More
The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More
About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More
Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.
CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More
I have written multiple articles about this year’s SPIE Advanced Lithography Conference describing all of the progress EUV has made in the last year. Source power is improving, photoresists are getting faster, prototype pellicles are in testing, multiple sites around the world are exposing wafers by the thousands and more. … Read More