I was invited to give a talk at this year’s ISS conference, the talk seemed to be very well received and I was asked to blog about it for SemiWiki. Parts of the talk will be familiar to SemiWiki readers from some of my previous blogs but I also went into more detail around some scaling challenges. The following is a summary of what… Read More
AMD vs Intel Update!
Is it just me or has AMD just pulled off one of the most amazing semiconductor comebacks of the century? Let’s take a closer look.
Who doesn’t long for the days when Intel and AMD went head to head in the battle for microprocessor supremacy? Back then Intel, was still operating under the Andrew Grove mantra of “Only the Paranoid Survive”… Read More
SPIE Advanced Lithography and Synopsys!
SPIE is the premier event for lithography held in Silicon Valley and again Scotten Jones and I will be attending. EUV is generally the star of the show and this year will be no different now that TSMC has committed to EUV production in 2019.
Last year at SPIE, TSMC presented the history of EUV development from the beginning in 1985 as … Read More
ISS Gary Patton Keynote: FD-SOI, FinFETS, and Beyond!
Two weeks ago the SEMI ISS Conference was held at Half Moon Bay in California. On the opening day of the conference Gary Patton CTO of GLOBALFOUNDRIES gave the keynote address and I also had the chance to sit down with Gary for an interview the next day.
AAPl Vs QCOM Who wins?
Things just got interesting in the iPhone supply chain with the $1B AAPL Vs QCOM legal action filed this week. For the life of me I could not understand why Apple second sourced the normally QCOM modem in the iPhone 7. It caused quite a stir in the technical community but we could only surmise that it was a price issue on the business side.… Read More
DARPA Flex Logix and TSMC!
When I first saw emerging semiconductor IP company Flex Logix actively involved with TSMC I knew something big was coming and boy was I right. DARPA announced today that an agreement is in place with Flex Logix to develop EFLX eFPGA technology on TSMC 16FFC for use by companies or Government agencies designing chips for the US Government.… Read More
Another Interesting Thing From TSMC!
As I mentioned in my previous post, the TSMC investor call this month was very interesting and Morris Chang was in fine form during the Q&A. As a semiconductor professional I think some of the questions are ridiculous but maybe they have value to the financial people. This one question from Randy, who I think is very astute, is … Read More
Fan-Out Wafer Level Processing Gets Boost from Mentor TSMC Collaboration
I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).
In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More
IP development strategy and hockey
One of the greatest hockey players of all time, Wayne Gretzky, provided a quote that has also been applied to the business world — “I skate to where the puck will be, not to where it has been.” It strikes me that this philosophy directly applies to IP development, as well. Engineering firms providing IP must anticipate… Read More
Intel Conveys Compute Card Capabilities at CES
Intel is once again adding a new computing form factor to the mix. At CES Intel announced its new Intel Compute Card. It combines CPU, GPU, DRAM, storage, WiFi, and communications inside a small modular housing slightly larger than a credit card and about 5mm thick. Intel already offers its Compute Stick, but it is limited in its interface… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot