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When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More
ASIC or FPGA? Each design style has earned designers’ votes depending on the level of urgency, application complexity and funding of their assigned projects. While it is feasible to transition from ASIC to FPGA design or vice versa, such a move is usually done across project refresh instead of midcourse.
The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More
Each year, TSMC hosts two major events for customers – the Technology Symposium in the spring, and the Open Innovation Platform Ecosystem Forum in the fall. The Technology Symposium provides updates from TSMC on:
… Read More
EDA has been flirting with the cloud unsuccessfully for many years now and it really comes down to a familiar question: Who can afford to spend billions of dollars on data center security? Which is similar to the question that started the fabless transformation: Who can afford to spend billions of dollars on semiconductor manufacturing… Read More
GLOBALFOUNDRIES (GF) recently announced they were abandoning 7nm and focusing on “differentiated” foundry offerings in a move our own Dan Nenni described as a “pivot”, a description GF appears to have embraced. Last week GF held their annual Technology Conference and we got to hear more about the pivot from new CEO Tom Caulfield… Read More
The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.
AI is revolutionizing and transforming virtually every industry… Read More
IP must be properly qualified before attempting to use them in any IC design flow. One cannot wait to catch issues further down the chip design cycle. Waiting for issues to appear during design verification poses extremely high risks, including schedule slippage. For example, connection errors in transistor bulk terminals where… Read More
One of the interesting rumors in Taiwan last week was the possibility that UMC and GF will do a deal to merge or UMC will buy some GF fabs. I have talked to quite a few industry experts about it and will talk to more this week at the GSA US Executive Forum (more at the end). The US Executive Forum is what they call a C Level event which means it… Read More
This is an ongoing conversation inside the semiconductor ecosystem, especially when I am traveling. Everyone wants to know what is going on here or there and since I just returned from Taiwan I will post my thoughts. Last week was also my birthday which was cut short due to the time change but I did get preferential treatment on the … Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot