Having spent 40 years in the semiconductor industry, many years working with Arm and even publishing the definitive history book “Mobile Unleashed: The Origin and Evolution of ARM Processors in Our Devices” plus having spent more than 20 years working with China based companies, I found the recent Arm China media circus quite … Read More
Intel Architecture Day – Part 2: GPUs, IPUs, XeSS, OpenAPI
Introduction
At the recent Intel Architecture Day presentations, a breadth of roadmap plans were provided – an earlier article focused on the x86 client and data center cores and products. This article focuses on the GPU and IPU announcements.
Xe Graphics Core
The Intel GPU architecture for embedded, discrete, and data center… Read More
Intel Architecture Day – Part 1: CPUs
Introduction
The optimization of computing throughput, data security, power efficiency, and total cost of ownership is an effort that involves managing interdependencies between silicon and packaging technologies, architecture, and software. We often tend to focus on the technology, yet the architecture and software… Read More
Expanding Intel’s Foundry Partnerships: A Critical Piece of IDM 2.0
One of the career Intel employees (33+ years) that Pat Gelsinger brought back is Stuart Pann. Stuart is now the Senior Vice President of the Intel Corporate Planning Group. He does not have direct foundry experience but he certainly knows Intel and Pat so it will be interesting to see where this goes.
Stuart recently penned an article… Read More
Semiconductor Growth to Continue in 2022
The semiconductor market showed powerful growth in 2Q 2021, up 8.3% from 1Q 2021 and up 29% from a year earlier, according to WSTS. Most major semiconductor companies experienced substantial revenue growth in the quarter. The memory companies were especially strong, with 2Q 2021 versus 1Q 2021 revenue (in local currency) up 19.6%… Read More
TSMC Wafer Wars! Intel versus Apple!
The big fake news last week came from a report out of China stating that TSMC won a big Intel order for 3nm wafers. We have been talking about this for some time on SemiWiki so this is nothing new. Unfortunately, the article mentioned wafer and delivery date estimates that are unconfirmed and from what I know, completely out of line. … Read More
TSMC Explains the Fourth Era of Semiconductor – It’s All About Collaboration
The 32nd VLSI Design/CAD Symposium just occurred in a virtual setting. The theme of the event this year was “ICs Powering Smart Life Innovation”. There were many excellent presentations across analog & RF, EDA & testing, digital & system, and emerging technology. There were also some excellent keynotes, and this… Read More
Mobileye’s Uncut Gem
Last week, Mobileye released a 40-minute long unedited video of the company’s camera-only Supervision automated driving system in action on the chaotic streets of New York City. The video release was part of an announcement of an expansion of Mobileye’s testing of autonomous vehicle technology including New York City (as the… Read More
Highlights of the “Intel Accelerated” Roadmap Presentation
Introduction
Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”. The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More
Intel Accelerated
Intel presented yesterday on their plans for process technology and packaging over the next several years. This was the most detailed roadmap Intel has ever laid out. In this write up I will analyze Intel’s process announcement and how they match up with their competitors.
10nm Super Fin (SF)
10nm is now in volume production in three… Read More


Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems