In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More
Soitec’s “Engineering the Future” Event at Semicon West 2025
As part of the broader Semicon West ecosystem in Phoenix, Arizona, Soitec, a global leader in engineered substrates for semiconductors, hosts an exclusive, invitation-style event titled Engineering the Future: Soitec Substrates Powering Technology Megatrends on Wednesday, October 8, 2025, from 2:30 PM to 6:00 PM MST.
Held… Read More
Yes Intel Should Go Private
Lip-Bu Tan started as Intel CEO on March 18th of this year and some very impressive changes have already taken place. Intel started the year with more than 100,000 employees and will finish the year with around 75,000. Reporting structures have been flattened and the Intel culture is being transformed back into an innovation driven… Read More
MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices
In a bold move to dominate the premium mobile chipset market, MediaTek unveiled the Dimensity 9500 on September 22, 2025, from Shenzhen, China. This flagship SoC promises to elevate 5G smartphones with unparalleled performance, on-device AI capabilities, and energy efficiency, positioning MediaTek as the undisputed leader… Read More
AI Revives Chipmaking as Tech’s Core Engine
A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
MediaTek’s first chipset using 2nm technology expected in late 2026
MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology,… Read More
Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
Podcast EP307: An Overview of SkyWater Technology and its Goals with Ross Miller
Dan is joined by Ross Miller, senior vice president at SkyWater Technology. Ross leads the industrial and aerospace businesses while steering the company’s branding, and corporate communications efforts. He is a seasoned semiconductor and technology executive with over 20 years of experience across startup, enterprise,… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet
Can cash and IBM collaboration put Japan into premier-league chipmaking? Rapidus is betting billions it can.
When Japan announced the creation of Rapidus in 2022, the news was met with a mix of enthusiasm and skepticism. The company would enter the market at a time of escalating demand for semiconductor fabrication capacity to… Read More
Revolutionizing Processor Design: Intel’s Software Defined Super Cores
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
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