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Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation

Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation
by Daniel Nenni on 10-01-2025 at 10:00 am

UNDER EMBARGO 1PM PT Sept 24 Synopsys TSMC OIP 2025 (1)

In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More


Revolutionizing AI Infrastructure: Alchip and Ayar Labs’ Co-Packaged Optics Breakthrough at TSMC OIP 2025

Revolutionizing AI Infrastructure: Alchip and Ayar Labs’ Co-Packaged Optics Breakthrough at TSMC OIP 2025
by Daniel Nenni on 10-01-2025 at 6:00 am

Alchip TSMC OIP 2025

In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More


Analog Bits Steps into the Spotlight at TSMC OIP

Analog Bits Steps into the Spotlight at TSMC OIP
by Mike Gianfagna on 09-29-2025 at 10:00 am

Analog Bits Steps into the Spotlight at TSMC OIP

The TSMC Open Innovation Platform (OIP) Ecosystem Forum kicked off on September 24 in Santa Clara, CA. This is the event where TSMC recognizes and promotes the vast ecosystem the company has created. After watching this effort grow over the years, I feel that there is nothing the group can’t accomplish thanks to the alignment and… Read More


Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More


SkyWater Technology Update 2025

SkyWater Technology Update 2025
by Daniel Nenni on 09-25-2025 at 10:00 am

Skywater Technologies HQ

SkyWater Technology, a U.S. based pure-play semiconductor foundry, has made significant strides in 2025 reinforcing its position as a leader in domestic semiconductor manufacturing. Headquartered in Bloomington, Minnesota, SkyWater specializes in advanced innovation engineering and high volume manufacturing of differentiated… Read More


TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging

TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
by Daniel Nenni on 09-25-2025 at 8:00 am

TSMC OIP 2025

In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More


Soitec’s “Engineering the Future” Event at Semicon West 2025

Soitec’s “Engineering the Future” Event at Semicon West 2025
by Daniel Nenni on 09-23-2025 at 10:00 am

Image Soitec event Semicon West

As part of the broader Semicon West ecosystem in Phoenix, Arizona, Soitec, a global leader in engineered substrates for semiconductors, hosts an exclusive, invitation-style event titled Engineering the Future: Soitec Substrates Powering Technology Megatrends on Wednesday, October 8, 2025, from 2:30 PM to 6:00 PM MST.

Held… Read More


Yes Intel Should Go Private

Yes Intel Should Go Private
by Daniel Nenni on 09-22-2025 at 10:00 am

Lip Bu Tan Intel

Lip-Bu Tan started as Intel CEO on March 18th of this year and some very impressive changes have already taken place. Intel started the year with more than 100,000 employees and will finish the year with around 75,000. Reporting structures have been flattened and the Intel culture is being transformed back into an innovation driven… Read More


MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices

MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices
by Daniel Nenni on 09-22-2025 at 6:00 am

MediaTek Dimensity9500 EN Transparent

In a bold move to dominate the premium mobile chipset market, MediaTek unveiled the Dimensity 9500 on September 22, 2025, from Shenzhen, China. This flagship SoC promises to elevate 5G smartphones with unparalleled performance, on-device AI capabilities, and energy efficiency, positioning MediaTek as the undisputed leader… Read More


AI Revives Chipmaking as Tech’s Core Engine

AI Revives Chipmaking as Tech’s Core Engine
by Daniel Nenni on 09-17-2025 at 8:00 am

The Economist

A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More