Tuple Banner
WP_Term Object
(
    [term_id] => 158
    [name] => Semiconductor
    [slug] => semiconductor-manufacturers
    [term_group] => 0
    [term_taxonomy_id] => 158
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1430
    [filter] => raw
    [cat_ID] => 158
    [category_count] => 1430
    [category_description] => 
    [cat_name] => Semiconductor
    [category_nicename] => semiconductor-manufacturers
    [category_parent] => 0
    [is_post] => 
)

The Twelve-Month Rule Does Not Describe a New Fab

The Twelve-Month Rule Does Not Describe a New Fab
by Admin on 08-20-2026 at 10:00 am

capex to wafer starts lag

By Nikhil Shah

Capital spending is often treated as if it becomes semiconductor capacity about twelve months later. That can be a useful rule for equipment installed in an existing fab. It is a poor description of a new fab built from the ground up.

I tested the distinction using five advanced-node projects in the United States where… Read More


The Fab Is Not the Finish Line

The Fab Is Not the Finish Line
by Moh Kolb on 08-20-2026 at 6:00 am

FAb is not the finish line (1)

AI may close the design. The fab may finish the silicon. Production still has to realize the system.

Semiconductor engineering is becoming extraordinarily capable.

EDA platforms are expanding from individual design tasks toward increasingly complete system analysis.

Multiphysics simulation is connecting electrical, … Read More


PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.

PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.
by Kalar Rajendiran on 08-18-2026 at 2:00 pm

PDF Solutions Direct Connect Block

The semiconductor industry doesn’t have a shortage of data. It has a shortage of ways to turn that data into useful manufacturing insights quickly enough to matter.

That is the problem PDF Solutions’ Exensio solution has addressed for years. Built specifically for semiconductor manufacturing, Exensio brings … Read More


Beyond Moore: Co-Optimizing AI from Systems to Materials

Beyond Moore: Co-Optimizing AI from Systems to Materials
by Daniel Nenni on 08-18-2026 at 10:00 am

Beyond Moore AI from manufacturing to Systems

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More


Podcast EP360: IDA Ireland’s Role to Expand Ireland’s Footprint Across the Semiconductor Ecosystem with Anne-Marie Tierney

Podcast EP360: IDA Ireland’s Role to Expand Ireland’s Footprint Across the Semiconductor Ecosystem with Anne-Marie Tierney
by Daniel Nenni on 08-14-2026 at 2:00 pm

Daniel is joined by Anne-Marie Tierney, Divisional Manager at IDA Ireland. Anne-Marie has 24 years’ experience in the global investment environment with IDA Ireland, working across several key roles in Ireland and abroad, positioning Ireland for high impact investments, with a specific interest in semiconductors. Prior … Read More


A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon

A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon
by Daniel Nenni on 08-14-2026 at 8:00 am

A 0.42 Nanometer Breakthrough Could Push Transistors Beyond Silicon

Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.

Silicon transistors are approaching physical limits that make each new generation… Read More


Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion

Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion
by Daniel Nenni on 08-12-2026 at 2:00 pm

Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion

Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More


Comparing Intel EMIB and Intel Foveros

Comparing Intel EMIB and Intel Foveros
by Daniel Nenni on 08-12-2026 at 10:00 am

Comparing Intel EMIB and Intel Foveros SemiWiki

Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More


Intel and TSMC Take Different Paths to High-NA EUV

Intel and TSMC Take Different Paths to High-NA EUV
by Daniel Nenni on 08-07-2026 at 8:00 am

Intel TSMC HNA EUV 2026

Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More


Intel Foundry and the DAC2026 Ecosystem

Intel Foundry and the DAC2026 Ecosystem
by Daniel Nenni on 08-07-2026 at 6:00 am

Intel Foundry DAC2026

The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.

Intel Foundry also made its presence felt, reminding everyone… Read More