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TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging

TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
by Daniel Nenni on 09-25-2025 at 8:00 am

TSMC OIP 2025

In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More


Soitec’s “Engineering the Future” Event at Semicon West 2025

Soitec’s “Engineering the Future” Event at Semicon West 2025
by Daniel Nenni on 09-23-2025 at 10:00 am

Image Soitec event Semicon West

As part of the broader Semicon West ecosystem in Phoenix, Arizona, Soitec, a global leader in engineered substrates for semiconductors, hosts an exclusive, invitation-style event titled Engineering the Future: Soitec Substrates Powering Technology Megatrends on Wednesday, October 8, 2025, from 2:30 PM to 6:00 PM MST.

Held… Read More


Yes Intel Should Go Private

Yes Intel Should Go Private
by Daniel Nenni on 09-22-2025 at 10:00 am

Lip Bu Tan Intel

Lip-Bu Tan started as Intel CEO on March 18th of this year and some very impressive changes have already taken place. Intel started the year with more than 100,000 employees and will finish the year with around 75,000. Reporting structures have been flattened and the Intel culture is being transformed back into an innovation driven… Read More


MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices

MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices
by Daniel Nenni on 09-22-2025 at 6:00 am

MediaTek Dimensity9500 EN Transparent

In a bold move to dominate the premium mobile chipset market, MediaTek unveiled the Dimensity 9500 on September 22, 2025, from Shenzhen, China. This flagship SoC promises to elevate 5G smartphones with unparalleled performance, on-device AI capabilities, and energy efficiency, positioning MediaTek as the undisputed leader… Read More


AI Revives Chipmaking as Tech’s Core Engine

AI Revives Chipmaking as Tech’s Core Engine
by Daniel Nenni on 09-17-2025 at 8:00 am

The Economist

A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More


MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency

MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
by Daniel Nenni on 09-16-2025 at 6:00 am

2nm

MediaTek’s first chipset using 2nm technology expected in late 2026

MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology,… Read More


Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology

Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
by Admin on 09-15-2025 at 10:00 am

Intel Foundry Packaging Evolution 2025

In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More


Podcast EP307: An Overview of SkyWater Technology and its Goals with Ross Miller

Podcast EP307: An Overview of SkyWater Technology and its Goals with Ross Miller
by Daniel Nenni on 09-12-2025 at 10:00 am

Dan is joined by Ross Miller, senior vice president at SkyWater Technology. Ross leads the industrial and aerospace businesses while steering the company’s branding, and corporate communications efforts. He is a seasoned semiconductor and technology executive with over 20 years of experience across startup, enterprise,… Read More


Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet

Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet
by Jonah McLeod on 09-09-2025 at 10:00 am

Rising Wafer

Can cash and IBM collaboration put Japan into premier-league chipmaking? Rapidus is betting billions it can.

When Japan announced the creation of Rapidus in 2022, the news was met with a mix of enthusiasm and skepticism. The company would enter the market at a time of escalating demand for semiconductor fabrication capacity to… Read More


Revolutionizing Processor Design: Intel’s Software Defined Super Cores

Revolutionizing Processor Design: Intel’s Software Defined Super Cores
by Admin on 09-07-2025 at 2:00 pm

Intel European CPU Patent Application

In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More