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From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters

From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters
by Daniel Nenni on 10-28-2026 at 10:00 am

Metrology, analytics, and autonomous manufacturing

Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More


The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up

The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up
by Lauro Rizzatti on 10-28-2026 at 8:00 am

Electric blue Soitec wafer cover

Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it.

Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More


When Nanomagnets Do the Math: France’s New Machine for Impossible Choices

When Nanomagnets Do the Math: France’s New Machine for Impossible Choices
by Admin on 10-28-2026 at 6:00 am

image002 (5)

French researchers have demonstrated a hybrid nanoelectronic “Ising machine” designed to solve difficult combinatorial optimization problems more efficiently. The experimental system combines two emerging device technologies—resistive memory and spintronics—to perform parts of an optimization algorithm through… Read More


Inside the Package Powering Modern AI

Inside the Package Powering Modern AI
by Daniel Nenni on 10-26-2026 at 8:00 am

TSMC CoWoS is Critical to AI Chips

TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More


From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation

From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
by Kalar Rajendiran on 10-22-2026 at 10:00 am

Gary Dickerson on the Stage

The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More


SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design

SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
by Admin on 10-22-2026 at 8:00 am

Human approval in an AI cleanroom

By Gleb Tsipursky

SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More


Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series

Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
by Daniel Nenni on 10-22-2026 at 6:00 am

Precision Testing for Edge AI Chips

Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More


Why America’s Semiconductor Manufacturing Capacity Matters

Why America’s Semiconductor Manufacturing Capacity Matters
by Daniel Nenni on 10-21-2026 at 8:00 am

Building America's chip future

America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More


The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip

The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
by Kalar Rajendiran on 10-20-2026 at 10:00 am

Partners Photo Op scaled

Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected

Artificial intelligence is changing what the semiconductor industry must deliver. … Read More


TSMC’s AI Expansion Signals a Broader Shift in Computing

TSMC’s AI Expansion Signals a Broader Shift in Computing
by Daniel Nenni on 10-16-2026 at 8:00 am

TSMC’s AI expansion

TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More