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TSMC Design Considerations for Gate-All-Around (GAA) Technology

TSMC Design Considerations for Gate-All-Around (GAA) Technology
by Tom Dillinger on 07-12-2021 at 6:00 am

mobility differences 3

The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology.  Indeed, the papers presented are divided into two main tracks – Circuits and Technology.  In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.

At… Read More


Apple’s Orphan Silicon

Apple’s Orphan Silicon
by Paul Boldt on 07-11-2021 at 6:00 am

T2 die anno lr

Apple’s recent Spring Loaded Event brought us M1-based iMacs.  After the MacBook Air and 13” MacBook Pro in the fall, iMacs are the third Mac to jettison Intel processors.  With this transition Apple’s T2 chip enters End of Life status, so to speak.  The T2 is a bit of an enigma and now it does not have much time left.

We know it performs… Read More


VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm

VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm
by Scotten Jones on 07-02-2021 at 6:00 am

Figure 1

At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More


Resist Development for High-NA EUV

Resist Development for High-NA EUV
by Tom Dillinger on 07-01-2021 at 10:00 am

EUV scaling

The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers.  Of particular importance is the chemistry of the photoresist materials and their interaction… Read More


 Semiconductor CapEx strong in 2021

 Semiconductor CapEx strong in 2021
by Bill Jewell on 06-23-2021 at 10:00 am

Semiconductor CAPEX spending versus change 2021

Semiconductor manufacturers are expanding capital spending in 2021 and beyond to help alleviate shortages. In addition, many governments around the world are proposing funding to support semiconductor manufacturing in their countries.

The United States Senate this month approved a bill which includes $52 billion to fund… Read More


Ten Lessons Learned from Andy Grove

Ten Lessons Learned from Andy Grove
by Betsy Corcoran on 06-20-2021 at 6:00 am

Andy Grove SemiWiki

I met Andy Grove on a sunny day in New York City in 1987. He was dashing to press interviews for his just-off-the-presses management book, “One on One with Andy Grove.” I was a freshly badged member of the press working for IEEE Spectrum, a year or so out of college, still toting my college backpack. Little did I know that that would be Read More


Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges

Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges
by Kalar Rajendiran on 06-16-2021 at 10:00 am

MegaTrends and Silicon Photonics

A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications.  The blog is based on listening to a technology presentation made by Dr. … Read More


Highlights of the TSMC Technology Symposium 2021 – Automotive

Highlights of the TSMC Technology Symposium 2021 – Automotive
by Tom Dillinger on 06-15-2021 at 6:00 am

automotive market growth v2

At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps.  Previous articles have reviewed the highlights of silicon process and packaging technologies.  The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More


Highlights of the TSMC Technology Symposium 2021 – Packaging

Highlights of the TSMC Technology Symposium 2021 – Packaging
by Tom Dillinger on 06-14-2021 at 6:00 am

3D Fabric

The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.

General

3DFabricTM

Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.

2.5D package technology – CoWoS

The 2.5D packaging options are divided into the CoWoS… Read More


Highlights of the TSMC Technology Symposium 2021 – Silicon Technology

Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
by Tom Dillinger on 06-13-2021 at 6:00 am

logic technology roadmap

Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap.  This article will review the highlights of the silicon process developments and future release plans.

Subsequent articles will describe the packaging offerings and delve into technology … Read More