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VSORA AI Processor Raises $46 Million to Fast-Track Silicon Development
We stand on the cusp of an era defined by ubiquitous intelligence—a stone’s throw from a tidal wave of AI-powered products underpinned by next-generation silicon. Realizing that future demands nothing less than a fundamental rethink of how we design semiconductors… Read More
Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More
The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More
The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging… Read More
At the pre-conference briefing, Dr. Kevin Zhang gave quite a few of us media types an overview of what will be highlighted at the 2025 TSMC Technical Symposium here in Silicon Valley. Since most of the semiconductor media are not local this was a very nice thing to do. I will be at the conference and will write more tomorrow after the … Read More
In a 2017 ISPD presentation, TSMC Fellow LC Lu outlined critical challenges and innovations in physical design to sustain power, speed, and area scaling trends in semiconductors. As Moore’s Law faces economic hurdles, process-design co-optimization emerges as key to extending it. Lu emphasized application-optimized… Read More
Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More
Great news last week as Intel fills the CEO slot for the 9th time in 56 years with industry legend Lip-Bu Tan. From what I hear, Intel employees, and the entire industry for that matter, are overjoyed. I’m sure there are one or two competing companies that are concerned but overall it is an absolute love fest.
If you look at education… Read More
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Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry