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Update on TSMC’s 3D Fabric Technology

Update on TSMC’s 3D Fabric Technology
by Tom Dillinger on 11-03-2021 at 8:00 am

3D eTV testchip

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

Overview of 3D Fabric

The TSMC… Read More


On-Chip Sensors Discussed at TSMC OIP

On-Chip Sensors Discussed at TSMC OIP
by Tom Simon on 11-02-2021 at 10:00 am

phase noise correlation

TSMC recently held their Open Innovation Platform (OIP) Ecosystem Forum event where many of their key partners presented on their latest projects and developments. This year one of their top IP provider partners, Analog Bits, gave two presentations. Analog building blocks have always been necessary as enabling technology … Read More


Design Technology Co-Optimization for TSMC’s N3HPC Process

Design Technology Co-Optimization for TSMC’s N3HPC Process
by Tom Dillinger on 11-02-2021 at 8:00 am

N3HPC performance comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

One of the topics that L.C. … Read More


Highlights of the TSMC Open Innovation Platform Ecosystem Forum

Highlights of the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 11-01-2021 at 8:00 am

N3 comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum.  The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC.  This article summarizes the highlights of the TSMC keynote from… Read More


Semiconductor CapEx too strong?

Semiconductor CapEx too strong?
by Bill Jewell on 10-28-2021 at 1:00 pm

Oct 2021 capex2

Semiconductor capital expenditures (CapEx) are on track for strong growth in 2021. For many companies the increase should continue into 2022. TSMC, the dominant foundry company, expects to spend $30 billion in CapEx in 2021, a 74% increase from 2020. TSMC announced in March it plans to invest $100 billion over the next three years,… Read More


Intel- Analysts/Investor flub shows disconnect on Intel, Industry & challenges

Intel- Analysts/Investor flub shows disconnect on Intel, Industry & challenges
by Robert Maire on 10-27-2021 at 2:00 pm

Pat Gelsinger Triple Spend

Analysts missed all warning signs until Intel spelled it out
12% stock drop shows disconnect and misunderstanding
No quick fix, this is a long term, uncertain problem & solution
Everyone ignored the obvious until it ran them over

A 12% stock drop is fault of investors/analysts not Intel

Whenever a stock drops 12% in one day there… Read More


TSMC Arizona Fab Cost Revisited

TSMC Arizona Fab Cost Revisited
by Scotten Jones on 10-13-2021 at 8:00 am

TSMC North America Fabs

Back in May of 2020 I published some comparisons of the cost to run a TSMC fab in Arizona versus their fabs in Taiwan. I found the fab operating cost based on the country-to-country difference to only be 3.4% higher in the US and then I found an additional 3.8% because of the smaller fab scale. Since that time, I have continued to encounter… Read More


The GlobalFoundries IPO March Continues

The GlobalFoundries IPO March Continues
by Daniel Nenni on 09-20-2021 at 6:00 am

Tom Caufield Pat Gelsinger

The GF Technology Summit was last week. It was virtual again this year but with a different format. It was a mix of live and recorded events which did include some cringe worthy moments but all-in-all it was well worth my time.

One of the biggest changes you will notice is the messaging. GF is no longer down in the technology trenches … Read More


ASML is the key to Intel’s Resurrection Just like ASML helped TSMC beat Intel

ASML is the key to Intel’s Resurrection Just like ASML helped TSMC beat Intel
by Robert Maire on 09-09-2021 at 6:00 am

TSMC INTEL ASML Hurricane 1

-Intel’s access to high-NA EUV tools may be their elixir of life
-TSMC’s EUV adoption helped it vault faltering Intel & Samsung
-Maybe ASML should invest in Intel like Intel invested in ASML
-Shoe is on the other foot- But cooperation helps chip industry

Intel is dependent upon ASML for its entire future
If Intel… Read More


The Arm China Debacle and TSMC

The Arm China Debacle and TSMC
by Daniel Nenni on 09-03-2021 at 6:00 am

Barnum and Baily Circus

Having spent 40 years in the semiconductor industry, many years working with Arm and even publishing the definitive history book “Mobile Unleashed: The Origin and Evolution of ARM Processors in Our Devices” plus having spent more than 20 years working with China based companies, I found the recent Arm China media circus quite … Read More