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– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0
Intel not only wants to catch TSMC but beat them at their own … Read More
Intel made a big splash on March 23, 2021 by doubling down on manufacturing with the creation of Intel Foundry Services (IFS). The big announcement was supported by potential customers such as Qualcomm, Cisco, Ericsson, Google, Amazon, Microsoft, and IBM. With an accompanying $20B investment, the EDA and equipment industries,… Read More
In January I presented at the ISS conference a comparison of Intel’s, Samsung’s and TSMC’s leading edge offerings. You can read a write-up of my presentation here.
With the problems going on at Intel, that article generated a lot of interest in the investment community, and I have been holding a lot of calls with analysts who are trying… Read More
New Intel CEO Pat Gelsinger is not wasting any time in changing the course of the largest semiconductor company the world has ever seen. Today he announced the IDM 2.0 strategy which will better leverage Intel’s manufacturing abilities. There is a lot to talk about here but let’s focus on the new Intel Foundry Services because the… Read More
At the recent ISSCC conference, Mozhgan Mansuri from Intel gave an enlightening (extended) short course presentation on all thing related to clocking, for both wireline and wireless interface design. [1] The presentation was extremely thorough, ranging from a review of basic clocking principles to unique circuit design … Read More
Intel is a semiconductor legend. Founded on July 18, 1968, the name Intel is short for Integrated Electronics. After leading Silicon Valley, the United Sates, and the world into the era of semiconductors through technical excellence, Intel has hit some challenging times. There has been quite a bit of CEO drama that we will look … Read More
Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention. Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More
The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. [1]
The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin. The “gate-all-around” characteristics… Read More
Bloomberg did an interview with my favorite semiconductor analyst Stacy Rasgon on “How the Number One U.S. Semiconductor Company Stumbled” that I found interesting. Coupled with the Q&A Bob Swan did at the Credit Suisse Annual Technology Conference I thought it would be good content for a viral blog.
Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More
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