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Open-Silicon Embraces the Latest ISO 9001 Specification with Certification by SGS

Open-Silicon Embraces the Latest ISO 9001 Specification with Certification by SGS
by Tom Simon on 11-07-2018 at 7:00 am

A quality standard that stays static and is not itself targeted for continuous improvement, is a standard that is breaking one of the first tenets of quality. This is why the ISO 9001 specification has been updated several times since its introduction in 1987. The first version was fairly modest. The most recent version was released… Read More


Custom SoC Platform Solutions for AI Applications at the TSMC OIP

Custom SoC Platform Solutions for AI Applications at the TSMC OIP
by Daniel Nenni on 09-27-2018 at 12:00 pm

The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.

AI is revolutionizing and transforming virtually every industry… Read More


Turnkey 2.5D HBM2 Custom SoC SiP Solution for Deep Learning and Networking Applications

Turnkey 2.5D HBM2 Custom SoC SiP Solution for Deep Learning and Networking Applications
by Daniel Nenni on 09-07-2018 at 7:00 am

Before we jump into the specifics, let us understand what’s driving custom solutions in the high performance computing and networking space. It’s the growing demand for core capacity and greater performance, which is due to the increase in the level of parallelism and multitasking required to handle the enormous amount of data… Read More


Deep learning fueling the AI revolution with Interlaken IP Subsystem

Deep learning fueling the AI revolution with Interlaken IP Subsystem
by Daniel Nenni on 07-30-2018 at 7:00 am

AI is revolutionizing and transforming virtually every industry in the digital world. Advances in computing power and deep learning have enabled AI to reach a tipping point toward major disruption and rapid advancement. However, these applications require much higher performance and bandwidth requiring new kinds of IP and… Read More


TSMC OIP DAC Theater Schedule 2018

TSMC OIP DAC Theater Schedule 2018
by Daniel Nenni on 06-20-2018 at 6:00 am

The TSMC OIP DAC Theater schedule is finalized and ready to go. It kicks off Monday at 10:15 am in booth #1629 and ends with a raffle at 5:45 pm each day (Mon-Tue-Wed) TSMC gives out some very nice prizes so check in with the TSMC booth staff when you arrive. There are 66 coveted presentation spots representing the top ecosystem partners… Read More


Webinar: Custom SoCs for Narrowband IoT

Webinar: Custom SoCs for Narrowband IoT
by Daniel Nenni on 05-30-2018 at 7:00 am

This joint CEVA and Open-Silicon webinar, moderated by myself, will elaborate on Narrowband IoT (NB-IoT) custom SoC solutions that are based on the CEVA-Dragonfly IP subsystem, and serve a wide range of cost- and power-sensitive IoT applications. Those joining the webinar will learn about the CEVA-Dragonfly NB1 IP subsystem,… Read More


Open-Silicon, Credo and IQ-Analog Provide Complete End-to-End Networking ASIC Solutions

Open-Silicon, Credo and IQ-Analog Provide Complete End-to-End Networking ASIC Solutions
by Camille Kokozaki on 04-26-2018 at 12:00 pm

The end-to-end principle as defined by Wikipedia is a design framework in computer networking. In networks designed according to this principle, application-specific features reside in the communicating end nodes of the network, rather than in intermediary nodes, such as gateways and routers, that exist to establish the … Read More


FlexE at SoC IP Days with Open Silicon

FlexE at SoC IP Days with Open Silicon
by Daniel Nenni on 03-30-2018 at 12:00 pm

On Thursday April 5th the Design and Reuse SoC IP days continues in Santa Clara at the Hyatt Regency (my favorite hangout). SemiWiki is a co-sponsor and I am Chairman of the IP Security Track. More than 400 people have registered thus far and I expect a big turnout, if you look at the program you will see why. You should also know that registration… Read More


Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More


Open Silicon Year in Review 2017

Open Silicon Year in Review 2017
by Daniel Nenni on 01-31-2018 at 7:00 am

If you are interested in what types of chips we will see in the coming years always ask an ASIC provider because they know. Companies of all sizes (small-medium-large) use ASIC companies to get their chips out in the least amount of time and at a minimum cost because that is what ASIC companies do.

IP is an important ingredient to the … Read More