800x100 Webinar (1)
WP_Term Object
(
    [term_id] => 16126
    [name] => Lithography
    [slug] => lithography
    [term_group] => 0
    [term_taxonomy_id] => 16126
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 164
    [filter] => raw
    [cat_ID] => 16126
    [category_count] => 164
    [category_description] => 
    [cat_name] => Lithography
    [category_nicename] => lithography
    [category_parent] => 0
    [is_post] => 
)

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good
by Robert Maire on 10-29-2023 at 10:00 am

KLAC Tencor
  • KLA has an OK quarter in an ugly market- bouncing along bottom
  • Like Lam & ASML, China was huge at 43% represents more risk
  • 2/3 Foundry/logic, 1/3 memory – Process tools were weak
  • No change, stable , no visibility on recovery
Quarter and guide were good in continued ugly industry

As expected KLAC reported earnings at the … Read More


ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?

ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?
by Robert Maire on 10-20-2023 at 8:00 am

ASML Monopoly
  • ASML reports in-line QTR but future looks flat for 2024
  • Downcycle finally hits litho leader- ASML monopoly solid as ever
  • Memory remains bleak – New China sanctions unclear
  • Recovery timing is unclear but planning for an up 2025
In Line Quarter and year as expected

Overall revenues came in at Euro6.7B with EPS at Euro4.81, more… Read More


ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity

ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity
by Robert Maire on 10-17-2023 at 8:00 am

ASML Monopoly
  • This past weeks over-reaction to Canon echoes the Sculpta Scare
  • Nanoimprint has made huge strides but is still not at all competitive
  • Shows basic lack of understanding of technology by some pundits
  • Chip industry has been searching for alternatives that don’t exist
Much ado about nothing much…..

This past week we … Read More


SPIE- EUV & Photomask conference- Anticipating High NA- Mask Size Matters- China

SPIE- EUV & Photomask conference- Anticipating High NA- Mask Size Matters- China
by Robert Maire on 10-09-2023 at 6:00 am

Conference EUV Lithography

– SPIE EUV & Photomask conference well attended with great talks
– Chip industry focused on next gen High NA EUV & what it impacts
– Do big chips=big masks? Another Actinic tool?
– AI & chip tools, a game changer- China pre-empting more sanctions

The SPIE EUV & Photomask conference in Monterey
Read More

Extension of DUV Multipatterning Toward 3nm

Extension of DUV Multipatterning Toward 3nm
by Fred Chen on 10-02-2023 at 8:00 am

Extension of DUV Multipatterning Toward 3nm

China’s recent achievement of a 7nm-class foundry node using only DUV lithography [1] raises the question of how far DUV lithography can be extended by multipatterning. A recent publication at CSTIC 2023 indicates that Chinese groups are currently looking at extension of DUV-based multipatterning to 5nm, going so far… Read More


Stochastic Model for Acid Diffusion in DUV Chemically Amplified Resists

Stochastic Model for Acid Diffusion in DUV Chemically Amplified Resists
by Fred Chen on 09-11-2023 at 8:00 am

Stochastic Model for Acid Diffusion in DUV Chemically Amplified Resists 1

Recent articles have focused much effort on studying the stochastic behavior of secondary electron exposure of EUV resists [1-4]. Here, we consider the implications of extending similar treatments to DUV lithography.

Basic Model Setup

As before, the model uses pixel-by-pixel calculations of absorbed photon dose, followed… Read More


Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials

Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials
by Rupesh Yelhekar on 09-06-2023 at 10:00 am

Banner Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials

Introduction

The ever-growing demand for faster, smaller, and more efficient electronic devices has fueled the semiconductor industry’s relentless pursuit of innovation. One crucial technology at the heart of semiconductor manufacturing is Extreme Ultraviolet Lithography (EUVL) to achieve smaller feature sizes… Read More


Modeling EUV Stochastic Defects with Secondary Electron Blur

Modeling EUV Stochastic Defects with Secondary Electron Blur
by Fred Chen on 08-30-2023 at 8:00 am

Modeling EUV Stochastic Defects With Secondary Electron Blur

Extreme ultraviolet (EUV) lithography is often represented as benefiting from the 13.5 nm wavelength (actually it is a range of wavelengths, mostly ~13.2-13.8 nm), when actually it works through the action of secondary electrons, electrons released by photoelectrons which are themselves released from ionization by absorbed… Read More


Enhanced Stochastic Imaging in High-NA EUV Lithography

Enhanced Stochastic Imaging in High-NA EUV Lithography
by Fred Chen on 08-21-2023 at 8:00 am

Enhanced Stochastic Imaging in High NA EUV Lithography

High-NA EUV lithography is the anticipated new lithography technology to be introduced for the 2nm node. Essentially, it replaces the 0.33 numerical aperture of current EUV systems with a higher 0.55 numerical aperture (NA). This allows the projection of smaller spot sizes and smaller pitches, roughly 60% smaller compared … Read More


Application-Specific Lithography: Via Separation for 5nm and Beyond

Application-Specific Lithography: Via Separation for 5nm and Beyond
by Fred Chen on 08-02-2023 at 8:00 am

1689394958554

With metal interconnect pitches shrinking in advanced technology nodes, the center-to-center (C2C) separations between vias are also expected to shrink. For a 5/4nm node minimum metal pitch of 28 nm, we should expect vias separated by 40 nm (Figure 1a). Projecting to 3nm, a metal pitch of 24 nm should lead us to expect vias separated… Read More