The white paper “Exploring the Latest Innovations in MIPI D-PHY and MIPI C-PHY” details the latest developments in these two critical high-speed interface technologies, highlighting how they evolve to meet modern demands in camera and display systems across automotive, industrial, healthcare, and XR applications.… Read More
Semiconductor Intellectual Property
448G: Ready or not, here it comes!
The march toward higher-speed networking continues to be guided by the same core objectives as has always been : increase data rates, lower latency, improve reliability, reduce power consumption, and maintain or extend reach while controlling cost. For the next generation of high-speed interconnects, these requirements … Read More
S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China
Shanghai, July 19, 2025 — S2C, a leader in functional verification, showcased its latest digital EDA solutions and key partnerships with BOSC, Xuantie, and Andes Technology at RISC-V Summit China 2025, highlighting its contributions to the ecosystem. The company also played a leading role in the EDA sub-forum, with VP Ying… Read More
What XiangShan Got Right—And What It Didn’t Dare Try
An Open ISA, a Closed Mindset — Predictive Execution Charts a New Path
The RISC-V revolution was never just about open instruction sets. It was a rare opportunity to break free from the legacy assumptions embedded in every generation of CPU design. For decades, architectural decisions have been constrained by proprietary patents,… Read More
WEBINAR: What It Really Takes to Build a Future-Proof AI Architecture?
Keeping up with competitors in many computing applications today means incorporating AI capability. At the edge, where devices are smaller and consume less power, the option of using software-powered GPU architectures becomes unviable due to size, power consumption, and cooling constraints. Purpose-built AI inference … Read More
Unlocking Efficiency and Performance with Simultaneous Multi-Threading
An Akeana hosted webinar on Simultaneous Multi-Threading (SMT) provided a comprehensive deep dive into the technical, commercial, and strategic significance of SMT in the evolving compute landscape. Presented by Graham Wilson and Itai Yarom, the session was not only an informative overview of SMT architecture and use cases,… Read More
UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era
CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.
While there are both software and hardware… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
By Tetsu Ho
With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business