Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
WEBINAR: FinFET UltraPcell Methodology
The custom physical implementation of circuit designs is a critical component of the integrated circuit (IC) process. Unfortunately, this step has been known to be one of the most time-consuming and prone to human error. Therefore, the need for a methodology that allows for faster, more accurate, and less error-prone work is … Read More
Gate Resistance in IC design flow
MOSFET gate resistance is a very important parameter, determining many characteristics of MOSFETs and CMOS circuits, such as:
• Switching speed
• RC delay
• Fmax – maximum frequency of oscillations
• Gate (thermal) noise
• Series resistance and quality factor in MOS capacitors and varactors
• Switching speed and uniformity… Read More
TSMC 2023 North America Technology Symposium Overview Part 2
The next topic I would like to cover is an update to the TSMC process node roadmap starting with N3. As predicted, N3 will be the most successful node in the TSMC FinFET family. The first version of N3 went into production at the end of last year (Apple) and will roll out with other customers in 2023. There is a reported record amount of … Read More
Achieving 400W Thermal Envelope for AI Datacenter SoCs
Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More
Intel Lands Top TSMC Customer
Most people will be surprised by this but after working in Taiwan for many years I quite expected it. Intel Announced that MediaTek will use Intel Foundry Services for FinFET based smart edge device chips. MediaTek will start with Intel 16nm technology which originated from the legendary 22nm, the first commercial FinFET process.… Read More
Can Intel Catch TSMC in 2025?
At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.
ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More
CEO Interview: Harald Neubauer of MunEDA
It has been my pleasure to interview Harald Neubauer, CEO of MunEDA. A veteran of the EDA industry, Harald cofounded MunEDA in 2001.
What brought you to the EDA industry?
Well, I always wanted to found a tech startup and was developing and evaluating various business ideas together with my later cofounder Andreas. Soon after we got… Read More
TSMC and the FinFET Era!
While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.
Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More
Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI