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WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1423
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 1423
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)

Highlights of the TSMC Technology Symposium 2021 – Automotive

Highlights of the TSMC Technology Symposium 2021 – Automotive
by Tom Dillinger on 06-15-2021 at 6:00 am

automotive market growth v2

At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps.  Previous articles have reviewed the highlights of silicon process and packaging technologies.  The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More


Highlights of the TSMC Technology Symposium 2021 – Packaging

Highlights of the TSMC Technology Symposium 2021 – Packaging
by Tom Dillinger on 06-14-2021 at 6:00 am

3D Fabric

The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.

General

3DFabricTM

Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.

2.5D package technology – CoWoS

The 2.5D packaging options are divided into the CoWoS… Read More


Highlights of the TSMC Technology Symposium 2021 – Silicon Technology

Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
by Tom Dillinger on 06-13-2021 at 6:00 am

logic technology roadmap

Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap.  This article will review the highlights of the silicon process developments and future release plans.

Subsequent articles will describe the packaging offerings and delve into technology … Read More


WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
by Mike Gianfagna on 06-10-2021 at 6:00 am

WEBINAR 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

If you are involved in designing systems that process data, you’re going to want to attend this webinar. Practically speaking, this should include a large percentage of the SemiWiki readership. Since data is the new oil there are a lot of applications drawn to data and information processing. Before we explore this webinar, let’s… Read More


Silicon Catalyst is Bringing Its Unique Startup Platform to the UK

Silicon Catalyst is Bringing Its Unique Startup Platform to the UK
by Mike Gianfagna on 06-08-2021 at 10:00 am

Silicon Catalyst is Bringing Its Unique Startup Platform to the UK

Silicon Catalyst is a unique startup incubator / accelerator that focuses exclusively on accelerating solutions in silicon (including chips, IP, MEMS & sensors). The organization has an extensive support infrastructure that includes preferred access to IP, design tools, business infrastructure and fab/assembly. … Read More


Analog Sensing Now Essential for Boosting SOC Performance

Analog Sensing Now Essential for Boosting SOC Performance
by Tom Simon on 06-03-2021 at 6:00 am

analog sensing

In today’s System-on-Chip (SOC), analog blocks are used in many places such as I/O cells for communication, PLLs for generating clocks, LDO’s for converting supply voltage to internal rail voltage, Sensors for qualifying external characteristics such as temperature, light, motion, etc. However new advanced designs now require… Read More


TSMC 2021 Technical Symposium Actions Speak Louder Than Words

TSMC 2021 Technical Symposium Actions Speak Louder Than Words
by Daniel Nenni on 06-01-2021 at 1:00 pm

TSMC Symposium 2021

The TSMC Symposium kicked of today. I will share my general thoughts while Tom Dillinger will do deep dives on the technology side. The event started with a keynote by TSMC CEO CC Wei followed by technology presentations by the TSMC executive staff.

C.C. Wei introduced a new sound bite this year that really resonated with me and that… Read More


Upcoming Webinar: PUFiot, A NeoPUF-based Secure Co-Processor

Upcoming Webinar: PUFiot, A NeoPUF-based Secure Co-Processor
by Kalar Rajendiran on 05-30-2021 at 10:00 am

PUFiot Applications

Throughout history, people have sought after security as a basic right and expectation within a civilized society. Even as recent as a few centuries ago, things were very simple. Subjects looked to their rulers to provide security for their lives and assets. Assets were mostly hard assets such as jewelry, coins or real estate. … Read More


Machine Learning Applied to Increase Fab Yield

Machine Learning Applied to Increase Fab Yield
by Tom Dillinger on 05-25-2021 at 8:00 am

enhanced defect images

Machine learning applications have become pervasive and increasingly complex, from recommendation agents in online interactions to personal assistants for command response to (ultimately) autonomous vehicle control.  Yet, an often overlooked facet of machine learning technology is the deployment in industrial process… Read More


WEBINAR: What Makes SoC Compiler The Shortest Path from SoC Design Specification to Logic Synthesis?

WEBINAR: What Makes SoC Compiler The Shortest Path from SoC Design Specification to Logic Synthesis?
by Daniel Nenni on 05-24-2021 at 6:00 am

SoC compiler puzzle

Defacto SoC Compiler whose 9.0 release was announced recently automates the SoC design creation from the first project specifications. It covers register handling, IP and connectivity insertion at RTL, UPF and SDC file generation right to logic synthesis. As part of the generation process of RTL and design collaterals, basic… Read More