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Who will Win in the Chiplet War?

Who will Win in the Chiplet War?
by Daniel Nenni on 01-16-2023 at 6:00 am

Chiplet APEC

The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!

“The First Annual Chiplet… Read More


CES is Back, but is the Market?

CES is Back, but is the Market?
by Bill Jewell on 01-11-2023 at 6:00 am

Jan 2023 CES 768x465 1

CES 2023, the annual consumer technology show, was held last week in Las Vegas, Nevada. Over 115,000 people attended and over 3200 companies exhibited. As shown below, attendance and exhibitors were up about 2 ½ times the pandemic limited CES 2022. However, attendance was down one-third and exhibitors were down 27% from CES 2020.… Read More


CES 2023 and all things cycling

CES 2023 and all things cycling
by Daniel Payne on 01-10-2023 at 10:00 am

smart tire company min

It’s January so time for me to review what I’ve found at CES this year that relates to cycling. Unlike last year when there were many last-minute cancellations from exhibitors, in 2023 it’s in-person and bigger than ever. The electrification of bikes continues, and many of these electronic devices are cloud… Read More


2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli

2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli
by Daniel Nenni on 01-10-2023 at 8:00 am

2022 Giovanni De Micheli

One of the first events on the 2023 EDA calendar is the Phil Kaufman Award ceremony and banquet honoring the 2022 recipient Dr. Giovanni De Micheli. The event, hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA), will be held Thursday, February 23, starting… Read More


IEDM 2022 – TSMC 3nm

IEDM 2022 – TSMC 3nm
by Scotten Jones on 01-02-2023 at 6:00 am

TSMC CPP

TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.

When … Read More


Analog to Digital Converter Circuits for Communications, AI and Automotive

Analog to Digital Converter Circuits for Communications, AI and Automotive
by Daniel Payne on 12-29-2022 at 6:00 am

RF Data Converters, analog to digital converter, min

Sensors are inherently analog in nature, and they get digitized for processing by using an Analog to Digital Converter (ADC) block. At the recent IP SoC event I had the chance to see the presentation by Ken Potts, COO of Alphacore on their semiconductor IP for ADCs. I learned that Alphacore started out in 2012, now offering both standard… Read More


Webinar: Flexible, Scalable Interconnect for AI HW System Architectures

Webinar: Flexible, Scalable Interconnect for AI HW System Architectures
by Mike Gianfagna on 12-09-2022 at 6:00 am

Webinar Flexible Scalable Interconnect for AI HW System Architectures

Building next generation systems is a real balancing act. The high-performance computing demands presented by increasing AI an ML content in systems means there are increasing challenges for power consumption, thermal load, and the never-ending appetite for faster data communications.  Power, performance, and cooling … Read More


IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
by Scotten Jones on 12-06-2022 at 10:00 am

Ann 2022 IEDM Plenary Dec. 5 Roadmap Slide

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More


Live Webinar: Code Review for System Architects

Live Webinar: Code Review for System Architects
by Daniel Nenni on 12-06-2022 at 6:00 am

Jade Banner

Register management tools have been used mostly in a bottom-up approach. There are some documents and/or spreadsheets created by the System Architects that are delivered to the design and verification teams. They then start capturing the HW/SW interface of the peripheral IPs in their in-house or commercial register management… Read More


Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More