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3DIC Physical Verification, Siemens EDA and TSMC

3DIC Physical Verification, Siemens EDA and TSMC
by Daniel Payne on 02-07-2023 at 10:00 am

3DIC min

At SemiWiki we’ve written four times now about how TSMC is standardizing on a 3DIC physical flow with their approach called 3Dblox, so I watched a presentation from John Ferguson of Siemens EDA to see how their tool flow supports this with the Calibre tools. With a chiplet-based packaging flow there are new physical verification… Read More


Advances in Physical Verification and Thermal Modeling of 3DICs

Advances in Physical Verification and Thermal Modeling of 3DICs
by Peter Bennet on 02-07-2023 at 6:00 am

Fig 1 3DIC

If, like me, you’ve been paying too little attention to historically less glamorous areas of chip design like packaging, you’ll wake up one day and realize just how much things have changed and continue to advance and how interesting it’s become.

One of the main drivers here is the increasing use of chiplets to counter the decreasing… Read More


Achieving Faster Design Verification Closure

Achieving Faster Design Verification Closure
by Daniel Payne on 02-01-2023 at 10:00 am

Questa Verification IQ min

On big chip design projects the logic verification effort can be larger than the design effort, taking up to 70% of the project time based on data from the 2022 Wilson Research Group findings. Sadly, the first silicon success rate has gone downwards from 31 percent to just 24 percent in the past 8 years, causing another spin to correct… Read More


Podcast EP141: The Role of Synopsys High-Speed SerDes for Future Ethernet Applications

Podcast EP141: The Role of Synopsys High-Speed SerDes for Future Ethernet Applications
by Daniel Nenni on 01-27-2023 at 10:00 am

Dan is joined by Priyank Shukla, Staff Product Manager for the Synopsys High Speed SerDes IP portfolio. He has broad experience in analog, mixed-signal design with strong focus on high performance compute, mobile and automotive SoCs and he has a US patent on low power RTC design.

Dan explores the use of high-speed SerDes with Priyank.… Read More


CTO Interview: John R. Cary of Tech-X Corporation

CTO Interview: John R. Cary of Tech-X Corporation
by Daniel Nenni on 01-27-2023 at 6:00 am

20220307SpanishHillsTacoDinner blurred 1

John R. Cary is professor of physics at the University of Colorado at Boulder and CTO of Tech-X Corporation. He received his PhD from the University of California, Berkeley, in Plasma Physics.  Prof. Cary worked at Los Alamos National Laboratory and the Institute for Fusion Studies at the University of Texas, Austin, prior to joining… Read More


Designing a ColdADC ASIC For Detecting Neutrinos

Designing a ColdADC ASIC For Detecting Neutrinos
by Kalar Rajendiran on 01-26-2023 at 6:00 am

The DUNE Experiment

Cliosoft recently hosted a webinar where Carl Grace, a scientist from Lawrence Berkeley National Laboratory (LBNL) talked about a cutting edge project for detecting neutrinos. The project is called the Deep Underground Neutrino Experiment (DUNE) project. Many of us know what a neutron is, but what is a neutrino? Before we get… Read More


Webinar: Achieving Consistent RTL Power Accuracy

Webinar: Achieving Consistent RTL Power Accuracy
by Daniel Nenni on 01-23-2023 at 10:00 am

Image4

A comprehensive report from the US Department of Energy (DOE), “Semiconductor Supply Chain Deep Dive Assessment” (February 2022) calls for a 1000X energy efficiency improvement that is required to maintain future compute requirement needs given a finite amount of world energy production. Energy efficiency is at the top of … Read More


2022 Retrospective. Innovation in Verification

2022 Retrospective. Innovation in Verification
by Bernard Murphy on 01-18-2023 at 10:00 am

Innovation New

As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome. And don’t forget to come see us at DVCon,… Read More


Arteris IP Acquires Semifore!

Arteris IP Acquires Semifore!
by Daniel Nenni on 01-10-2023 at 5:45 am

Arteris Ip Magillem Semifore 3

The semiconductor ecosystem consolidation continues with an interesting acquisition of an EDA company by an IP company. Having worked with both Arteris and Semifore over the past few years I can tell you by personal experience that this is one of those 1+1=3 types of acquisitions, absolutely.

Semifore was founded in 2006 by a team… Read More


Formal Datapath Verification for ML Accelerators

Formal Datapath Verification for ML Accelerators
by Bernard Murphy on 01-04-2023 at 10:00 am

Datapath complexity min

Formal methods for digital verification have advanced enormously over the last couple of decades, mostly in support of verification in control and data transport logic. The popular view had been that datapath logic was not amenable to such techniques. Control/transport proofs depend on property verification; if a proof is … Read More