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EDA

Electronic Design Automation

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FinFET Modeling and Extraction at 16-nm

FinFET Modeling and Extraction at 16-nm
by Daniel Payne on 12-18-2012 at 12:05 pm
Categories: EDA, FinFET, Synopsys

In 2012 FinFET is one of the most talked about MOS technologies of the year because traditional planar CMOS has slowed down on scaling below the 28nm node. To learn more about FinFET process modeling I attended a Synopsys webinar where Bari Biswas presented for about 42 minutes include a Q&A portion at the end.


Bari Biswas, Synopsys… Read More

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Double Patterning Tutorial

Double Patterning Tutorial
by Paul McLellan on 12-17-2012 at 4:07 am
Categories: EDA, Siemens EDA

Double patterning at 20nm is one of those big unavoidable changes that it is almost impossible to know too much about. Mentor’s David Abercrombie, DFM Program Manager for Calibre, has written a series of articles detailing the multifaceted impacts of double patterning on advanced node design and verification. There is… Read More

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Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
by Paul McLellan on 12-16-2012 at 10:00 pm
Categories: Ansys, Inc., EDA

Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.

On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More

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Apache Presents: ESD analysis

Apache Presents: ESD analysis
by Paul McLellan on 12-13-2012 at 1:15 am
Categories: Ansys, Inc., EDA

The 26th Conference on VLSI Design will be in Pune, India from January 5th to 10th at the Hyatt Regency. Details on the conference here. Registration here. I happened to be involved in the first of these conferences, which was held in Edinburgh where I was wrapping up my PhD. It was in the considerably less palatial surroundings of … Read More

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A Brief History of Synopsys

A Brief History of Synopsys
by Daniel Nenni on 12-12-2012 at 1:00 pm
Categories: EDA, Synopsys

One of the largest software companies in the world, Synopsys is a market and technology leader in the development and sale of electronic design automation (EDA) tools and semiconductor intellectual property (IP). Synopsys is also a strong supporter of local education through the Synopsys Outreach Foundation. Each year in multiple… Read More

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Happy Holidays

Happy Holidays
by Paul McLellan on 12-10-2012 at 3:00 pm
Categories: EDA

At times of this year, companies usually get their salespeople to submit the names and addresses of all their customers. They then get an expensive card printed and mail it out. What the recipient does is anyone’s guess, from throwing it straight in the bin to using it to decorate the office.

Atrenta decided to do something … Read More

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Zynq out of the box, in FPGA-based prototyping

Zynq out of the box, in FPGA-based prototyping
by Don Dingee on 12-10-2012 at 11:24 am
Categories: Aldec, EDA, FPGA

Roaming around the hall at ARM TechCon 2012 left me with eight things of note, but one of the larger ideas showing up everywhere is the Xilinx Zynq. Designers are enthralled with the idea of a dual-core ARM Cortex-A9 closely coupled with programmable logic.… Read More

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Double Patterning Verification

Double Patterning Verification
by Paul McLellan on 12-10-2012 at 3:03 am
Categories: EDA, Synopsys

You can’t have failed to notice that 20nm is coming. There are a huge number of things that are different about 20nm from 28nm, but far and away the biggest is the need for double patterning. You probably know what this is by now, but just in case, here is a quick summary.

Lithography is done using 193nm light. Today we use immersion… Read More

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Apache Power Artist Capabilities II

Apache Power Artist Capabilities II
by Paul McLellan on 12-09-2012 at 4:00 pm
Categories: Ansys, Inc., EDA

This is the second part of my discussion with Paul Traynar, Apache’s PowerArtist guru. The first part discussed sequential reduction capabilities. Part I was here.

There are two big challenges with doing power analysis at the RTL level. Firstly, how do you get an accurate enough model of what the design will dissipate given… Read More