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EDPS: 3D ICs, part II

EDPS: 3D ICs, part II
by Paul McLellan on 04-12-2012 at 10:00 pm

Part I is here.

In the panel session at EDPS on 3D IC a number of major issues got highlighted (highlit?).

The first is the problem of known-good-die (KDG) which is what killed off the promising multi-chip-module approach, perhaps the earliest type of interposer. The KDG problem is that with a single die in a package it doesn’t… Read More


Doing what others don’t do

Doing what others don’t do
by Paul McLellan on 04-12-2012 at 2:56 pm

Wally Rhines’ keynote at U2U, the Mentor users’ group meeting, was about Mentor’s strategy of focusing on what other people don’t do. This is partially a defensive approach, since Mentor has never had the financial firepower to have the luxury of focusing all their development on sustaining their products and then make … Read More


Cadence support for the Open NAND Flash Interface (ONFI) 3.0 controller and PHY IP solution + PCIe Controller IP opening the door for NVM Express support

Cadence support for the Open NAND Flash Interface (ONFI) 3.0 controller and PHY IP solution + PCIe Controller IP opening the door for NVM Express support
by Eric Esteve on 04-11-2012 at 10:19 am

The press release about ONFI 3.0 support was launched by Cadence at the beginning of this year. It was a good illustration of Denali, then Cadence, long term commitment to Nand Flash Controller IP support. The ONFI 3 specification simplifies the design of high-performance computing platforms, such as solid state drives and enterprise… Read More


Analog Automation – Needs Design Perspective

Analog Automation – Needs Design Perspective
by Pawan Fangaria on 04-11-2012 at 7:00 am

Recently I was researching the keynote speeches of isQED (International Society for Quality Electronic Design) Symposium 2012 and saw the very first, great presentation, “Taming the Challenges in Advanced Node Design” by Tom Beckley, Sr. VP at Cadence. I know Tom very well as I have worked with him and I admire his knowledge, authority… Read More


EDPS: 3D ICs, part I

EDPS: 3D ICs, part I
by Paul McLellan on 04-10-2012 at 10:00 pm

The second day (more like a half-day) of EDPS was devoted to 3D ICs. There was a lot of information, too much to summarize in a few hundred words. The keynote was by Riko Radojcic of Qualcomm, who has been a sort of one-man-band attempting to drive the EDA and manufacturing industries towards 3D. Of course it helps if you don’t … Read More


MEMS and IC Co-design

MEMS and IC Co-design
by Daniel Payne on 04-10-2012 at 11:37 am

This morning I attended a webinar about MEMS and IC co-design from a company called SoftMEMS along with Tanner EDA. I learned that you can co-design MEMS and IC either in a bottom-up or top-down methodology, and that this particular flow has import/export options to fit in with your mechanical simulation tools (Ansys, Comsol, Open… Read More


Oasys Gets Funding from Intel and Xilinx

Oasys Gets Funding from Intel and Xilinx
by Paul McLellan on 04-10-2012 at 8:00 am

Oasys announced that it closed its series B funding round with investments from Intel Capital and Xilinx. The fact that any EDA company has closed a funding round is newsworthy these days; companies running out of cash and closing the doors seems to be a more common story.

Oasys has been relatively quiet, which some people have taken… Read More


EDPS: Parallel EDA

EDPS: Parallel EDA
by Paul McLellan on 04-08-2012 at 10:00 pm

EDPS was last Thursday and Friday in Monterey. I think that this is a conference that more people would benefit from attending. Unlike some other conferences, it is almost entirely focused around user problems rather than doing a deep dive into things of limited interest. Most of the presentations are more like survey papers and… Read More


Designing for Reliability

Designing for Reliability
by Paul McLellan on 04-08-2012 at 8:06 pm

Analyzing the operation of a modern SoC, especially analyzing its power distribution network (PDN) is getting more and more complex. Today’s SoCs no longer operate on a continuous basis, instead functional blocks on the IC are only powered up to execute the operation that is required and then they go into a standby mode, … Read More


Synopsys Users Group 2012 Keynote: Dr Chenming Hu and Transistors in the Third Dimension!

Synopsys Users Group 2012 Keynote: Dr Chenming Hu and Transistors in the Third Dimension!
by Daniel Nenni on 04-08-2012 at 7:00 pm

It was an honor to see DR. Chenming Huspeak and to learn more about FinFets, a technology he has championed since 1999. Chenming is considered an expert on the subject and is currently a TSMC Distinguished Professor of Microelectronics at University of California, Berkeley. Prior to that he was the Chief Technology Officer of TSMC.… Read More