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Thermal Analysis for 3D SoC Integration

Thermal Analysis for 3D SoC Integration
by Daniel Payne on 11-21-2013 at 7:01 pm

The first time that I saw a DRAM in a ceramic package running on a tester I made the mistake of touching my finger to the metal lid, scorching my finger and teaching me a lesson that ICs can run extremely hot. I’ve read a lot the past few years about 3D IC design, and immediately my mind becomes curious about how an engineer would go… Read More


The Rosetta Stone of Lithography

The Rosetta Stone of Lithography
by Paul McLellan on 11-20-2013 at 3:14 pm

At major EDA events, CEDA (the IEEE council on EDA, I guess you already know what that bit stands for) hosts a lunch and presentation for attendees and others. This week was ICCAD and the speaker was Lars Liebmann of IBM on The Escalating Design Impact of Resolution-Challenged Lithography. Lars decided to give us a whirlwind tour … Read More


IoT begets silicon, interoperability, and standards

IoT begets silicon, interoperability, and standards
by Don Dingee on 11-19-2013 at 5:00 pm

The Internet of Things is on every technology mind these days, but what does it mean for the EDA community? Dennis Brophy of Mentor Graphics says the billions of things we are hearing about will not happen unless we find a way to build a lot more things, efficient things, and connected things. He has more thoughts in our recent interview.… Read More


Meeting the Challenges of Designing Internet of Things SoCs with the Right Design Flow and IP

Meeting the Challenges of Designing Internet of Things SoCs with the Right Design Flow and IP
by Daniel Nenni on 11-18-2013 at 7:00 pm

Connecting “things” to the Internet and enabling sensing and remote control, data gathering, transmission, and analysis improves many areas: safety and quality of life, healthcare, manufacturing and service delivery, energy efficiency, and the environment. The concept of the Internet of Things (IoT) is quickly becoming… Read More


Design Methodology and its Impact on the Future of Electronics

Design Methodology and its Impact on the Future of Electronics
by Paul McLellan on 11-18-2013 at 3:20 pm

Today at the Semisrael Expo 2013 (in Israel of course) Ajoy Bose gave a keynote on how design methodology will impact electronics. The big pictures is that microelectronics is driven by some major disruptive forces and, as a result, technology and industry are evolving dramatically, which creates a need for research and innovation… Read More


Cadence Design Systems’ Shares Are Surprisingly Cheap

Cadence Design Systems’ Shares Are Surprisingly Cheap
by Ashraf Eassa on 11-17-2013 at 10:00 pm

In the third and final (for now) part of this series on the EDA design tool vendors, I’d like to take a closer look at Cadence Design Systems. This is probably the most interesting of the three from both an industry perspective as well as an investment perspective for a variety of reasons. With that said I’d like to first provide some … Read More


A Brief History of eSilicon

A Brief History of eSilicon
by Daniel Nenni on 11-16-2013 at 10:00 pm

eSilicon Corporation was founded in 2000 with Jack Harding as the founding CEO and Seth Neiman of Crosspoint Venture Partners as the first venture investor and outside Board member. They both remain involved in the company today, with Jack continuing as CEO and Seth now serving as Chairman of the Board.

Both Harding and Neiman brought… Read More


Social Media at Synopsys

Social Media at Synopsys
by Daniel Payne on 11-15-2013 at 4:35 pm

When I talk about social media and mention Synopsys you may quickly think of Karen Bartleson, the Senior Director of Community Marketing, because she:

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TowerJazz and Silvaco BFF

TowerJazz and Silvaco BFF
by admin on 11-15-2013 at 1:04 pm

Last week was the TowerJazz Technology Fair 2013. TowerJazz is the fourth biggest foundry in the world after TSMC, GF and UMC. They have fabs in Newport Beach (the old Jazz, itself with roots in Rockwell), two in Israel (the old Tower, with roots in National Semiconductor) and one in Japan (acquired from Micron). The technology fair… Read More


Signoff Summit: The Fastest Path to Design Signoff

Signoff Summit: The Fastest Path to Design Signoff
by Daniel Nenni on 11-13-2013 at 8:00 pm

Cadence’s Signoff Summit will be held next week, November 21 at Cadence in San Jose.

This is the first of a series of all-day Signoff Summits from Cadence that focus on the multiple facets of design signoff. This first summit will include keynote addresses plus sessions covering the multiple solution components that comprise… Read More