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Coventor, Lego and IoT in Denmark

Coventor, Lego and IoT in Denmark
by Paul McLellan on 04-17-2015 at 7:00 am

Coventor were in Copenhagen Denmark a few weeks ago at the Smart Systems Integration Conference to talk about MEMS and IoT entitled (take a deep breath) Towards a Lego Block Principle for Heterogonous Systems Design Including MEMS and Electronics—Choose and Put Together Fit. Since this seems to have become IoT week for me, without… Read More


Don’t Miss Mentor Graphics U2U San Jose, April 21, 2015

Don’t Miss Mentor Graphics U2U San Jose, April 21, 2015
by Beth Martin on 04-16-2015 at 10:00 pm

Mentor Graphics’ User2User conference will be held next week on April 21[SUP]st[/SUP] at the San Jose DoubleTree Hotel. This one-day, free conference is the perfect opportunity to learn, network, and share with other Mentor Graphics users.

The day starts off with back-to-back keynotes that examine different aspects of the … Read More


Will your next SoC fail because of power noise integrity in IP blocks?

Will your next SoC fail because of power noise integrity in IP blocks?
by Daniel Payne on 04-14-2015 at 5:00 pm

By the time that your SoC comes back from the fab and you plugin it into a socket on a board for testing, it’s a little late in the cycle to start thinking about reliability concerns like: dynamic voltage drop, noise coupling, EM (Electro-Migration), self-heating, thermal analysis and ESD (Electro-Static Discharge). They… Read More


GPP, GPU or Embedded Vision Dedicated Processor?

GPP, GPU or Embedded Vision Dedicated Processor?
by Eric Esteve on 04-14-2015 at 9:04 am

Before answering the question we should try to define what is behind “Vision”, which type of applications and evaluate this heterogeneous market weight. Embedded Vision (EV) is the use of computer vision in embedded systems to interpret meaning from image or video. In fact vision processing requires a lot of maths functions that… Read More


Advances in Nanometer Analog and Mixed Signal Design!

Advances in Nanometer Analog and Mixed Signal Design!
by Daniel Nenni on 04-13-2015 at 10:00 pm

Mentor’s annual user group meeting at the Doubletree Hotel in San Jose, CA is coming up on Tuesday, April 21[SUP]st[/SUP]. This complementary event provides a unique opportunity to share design techniques and exchange ideas with other users and experts in the design community. As you may have read I am the star of the show; moderating… Read More


Beyond CMOS: Three Industry Teams Aim at Next Generation of High-performance Computing

Beyond CMOS: Three Industry Teams Aim at Next Generation of High-performance Computing
by admin on 04-12-2015 at 10:00 pm

Given the current limitations with CMOS designs, such as low temperature thresholds and efficiency in power consumption, there is a vast need to expand into superconducting computers in order to manage consumers’ need for power and performance. Although supercomputers require extremely low temperatures, they are capable… Read More


Safety Dominates Agenda in DAC’s Automotive Track

Safety Dominates Agenda in DAC’s Automotive Track
by Majeed Ahmad on 04-12-2015 at 4:00 pm

The connected car movement is in full bloom, making headlines in the trade media on how the cutting-edge electronics will transform the twenty-first century driving experience. However, a closer look at the Internet of cars juggernaut shows that safety and security of the networked vehicle are still a major stumbling block.… Read More


Sidense NVM Scores Qualification on GLOBALFOUNDRIES 28nm SLP and HPP

Sidense NVM Scores Qualification on GLOBALFOUNDRIES 28nm SLP and HPP
by Tom Simon on 04-12-2015 at 7:00 am

A tremendous number of chips being designed for today’s products require some sort of onboard data storage. The size of these needs range from a handful of bytes, for trim and calibration storage, to something much more substantial like boot code storage. In both of these examples the storage ideally should be nonvolatile, with… Read More


Cu-Pillar in Advanced Logic Devices

Cu-Pillar in Advanced Logic Devices
by Arabinda Das on 04-10-2015 at 7:00 pm

In 2001, flipchip with solder bump was already a dominant technology and it was replacing wire bonding as the main interconnection choice for a growing number of devices. It was offering fine pitch interconnections for increased I/O counts. In the solder bump process, a bump is formed on the chip and on the package substrate and … Read More


ANSYS Enters the League of 10nm Designs with TSMC

ANSYS Enters the League of 10nm Designs with TSMC
by Pawan Fangaria on 04-09-2015 at 7:00 pm

The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More