A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More
Electronic Design Automation
Cadence Adds New Dimension to SoC Test Solution
It requires lateral thinking in bringing new innovation into conventional solutions to age-old hard problems. While the core logic design has evolved adding multiple functionalities onto a chip, now called SoC, the structural composition of DFT (Design for Testability) has remained more or less same based on XOR-based compression… Read More
Updated tool cuts through DO-254 V&V chaos
Audits. The mere mention of the word keeps project managers up at night and sends most designers running. However, in the case of FPGA designs seeking DO-254 compliance, the product doesn’t ship until the audit is complete – there is no avoiding it, or skating around it.… Read More
Expanding 3D EM Simulation Access to All
James Clerk Maxwell’s eponymous equations are the basis for simulating electromagnetic wave propagation. In school, EE majors tended to fall into two camps: (a) those that thoroughly enjoyed their fields and waves classes, who liked doing surface integrals, and who were adept at demonstrating the “right hand rule”, and (b) … Read More
HSPICE – 35 and looking good!
A maturetool. A legacytool. A tool that’s a little long in the tooth. We have all used these terms to refer to an EDA product that has not been able to keep up with technical challenges of model complexity, performance, or new features required by current SoC and system design requirements.… Read More
DesignCon 2016 — signal integrity must be power-aware!
DesignCon is a unique conference — its tagline is “Where the Chip meets the Board”. Held each January in Santa Clara, the conference showcases a wealth of new technologies for advanced packaging, printed circuit board fabrication, connectors, cables, and related analysis equipment (e.g, BERT, VNA, scopes). Of specific… Read More
The Mechanical Reliability of IC Packages
At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More
5nm Chips? Yes, but When?
For any invention, technical proof of concept or prototyping happens years ahead of the invention being infused into actual products. When we talk about 5nm chip manufacturing, a test chip was already prototyped in last October, thanks to Cadence and Imec. Details about this chip can be found in a blog at Semiwiki (link is given … Read More
Domain Crossing Verification Needs Continue to Grow
Clock domain crossing (CDC) analysis has been around for many years, initially as special checks in verification or static timing analysis, but it fairly quickly diverged into specialized tools focused just on this problem. CDC checks are important because (a) you can lose data or even lock up at, or downstream of a poorly-handled… Read More
Evaluating the Performance of Design Data Management Software
In the wake of increased global competitiveness and shorter time-to-market windows, there has been a renewed focus by design management on the underlying data management infrastructure of the design teams. An increasing number of systems-on-chip (SoCs) now have some type of analog, digital and/or RF modules, making it imperative… Read More


A Century of Miracles: From the FET’s Inception to the Horizons Ahead