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I had time for lunch on Monday. That is to say, there was a Cadence panel session about Has Timing Signoff Innovation has become and Oxymoron? What Happened and How Do We Fix It?
The moderator was Brian Fuller, lately of EE Times but now Editor-in-Chief at Cadence (I’m not sure quite what it means either). On the panel were Dipesh… Read More
As I have mentioned before, Cliosoft is the biggest little company in EDA with the most talked about products on SemiWiki. At DAC, ClioSoft will introduce integrated SOS design management (DM) solutions providing revision control, design management and multi-site team collaboration for Aglient Technologies’ Advanced Design… Read More
My 8 years as an IC circuit designer were at the transistor-level, so if that interests you as well then consider what there is to see from Cadence at DAC this year. IC design technology is changing quickly, so keeping up to date is important for your job security and continual education goals.
Here’s what I would recommend attending… Read More
Today Cadence announced Tempus, their new timing signoff solution. This has been in development for at least a couple of years and has been built from the ground up to be massively parallelized. Not just that different corners can be run in parallel (which is basically straightforward) but that large designs can be partitioned … Read More
Cadence is a DAC anchor, everyone will visit their booth, so lets look at their technical sessions and put our agendas together. Lets start with the breakfast/lunch sessions because Cadence usually puts out quite a spread, we all gotta eat and free food tastes even better:
Has “Timing Signoff Innovation” Become an Oxymoron? What… Read More
Design IP, at least Interface IP, is about 15 years old, but the market was made of one large provider – Synopsys- with many small vendors around. Chip makers were not very comfortable with this picture, especially the Tier 1 considering that the risk (to see the big one being acquired by one of their direct competitor, say Samsung… Read More
Every process node these days has a new “gotcha” that designers need to be aware of. In some ways this has always been the case but the changes used to be gradual. But now each process node has something discontinuously different. At 20nm the big change is double patterning. At 14/16nm it is FinFET.
Rahul Deokar and John… Read More
Often a question is raised about how SystemC improves verification time when the design has to go through RTL in any case. A simple answer is that with SystemC, designs can be described at a higher level of abstraction and then automatically synthesized to RTL. When the hands-on design and verification activity is at a higher level,… Read More
TSMC has been investing in the fabless semiconductor ecosystem for 25+ years and that is why they are the #1 foundry and lead this industry (my opinion). I’m a big fan of joint webinars. Not only is it collaboration open to the masses, it is a close collaboration between the two sponsoring companies. Having worked on the TSMC… Read More
We’ve blogged before about Layout Dependent Effects (LDE) on SemiWiki and how it further complicates the IC design and layout process, especially at 28nm and lower nodes because the IC layout starts to change the MOS device performance. There’s an interesting webinarfrom Cadence on Variation-aware IC Design, … Read More
Podcast EP16: Hyperscale Computing & Changes in the Datacenter
Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus
Podcast EP255: The Growing Proliferation of Semiconductors and AI in Cars with Amol Borkar
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