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The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More
Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More
These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More
The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!
“The First Annual Chiplet… Read More
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
Chiplets have been trending on SemiWiki for the past two years and I think that will continue into the distant future. As a potential way to unclog Moore’s Law, you can bet the semiconductor ecosystem will prove once again to be a chiplet force of nature driving semiconductor company roadmaps to smaller and better things.
To be clear,… Read More
“We intend to grow revenue 14% to 15%, continue to drive notable ops margin expansion and aim for approximately 16% non-GAAP earnings per share growth.”
Synopsys, Inc. (NASDAQ:SNPS) Q4 2022 Earnings Call Transcript
Synopsys is the EDA bellwether since they report early and are the #1 EDA and #1 IP company. In addition to crossing… Read More
Before chiplets arrived, it seemed like designing an electronic system was a bit simpler, as a system on chip (SoC) methodology was well understood, and each SoC was mounted inside a package, then the packages for each component were interconnected on a printed circuit board (PCB). The emerging trend to design a 3D IC using chiplets… Read More
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