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An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets at DAC#59 was OpenFive, a 17+ year spec-to-silicon… Read More
Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More
Chiplets are hot now as a way to extend Moore’s Law, dividing functionality across multiple die within a single package. It’s no longer practical to jam all functionality onto a single die in the very latest processes, exceeding reticle limits in some cases and in others straining cost/yield. This is not an academic concern. Already… Read More
…and support the creation of successful Chiplet business
The One-Stop-Shop model has allowed IP vendors of the 2000’s to create a successful IP business, mostly driven by consumer application, smartphone or Set-Top-Box. The industry has dramatically changed, and in 2020 is now driven by data-centric application (datacenter,… Read More
For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More
The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More
The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More
From a business viewpoint we often read in the technical press about the virtues of applying AI, and in the early days most of the AI model building was done in the cloud, because of the high computation requirements, yet there’s a developing trend now to use AI accelerators at the Edge. The other mega-trend in the past decade… Read More
It was nice to be at a live conference again. DesignCon was held at the Santa Clara Convention Center, my favorite location, which to me there was a back to normal crowd. The sessions I attended were full and the show floor was busy. Masks and vaccinations were not required, maybe that was it. Or there was a pent-up demand to get back engaged… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot