Full Spectrum Analog FastSPICE Useful for RF Designs on Bulk CMOS

Full Spectrum Analog FastSPICE Useful for RF Designs on Bulk CMOS
by Tom Simon on 03-19-2015 at 1:00 pm

It has been about a year since the acquisition of Berkeley Design Automation by Mentor Graphics. Berkeley was doing quite well in the somewhat crowded SPICE simulator market. In many respects they broke new ground for high speed and accurate SPICE simulators. Since the acquisition we know that former Berkeley executives are now… Read More


Mapping Focus and Dose onto BEOL Fabrication Effects

Mapping Focus and Dose onto BEOL Fabrication Effects
by Tom Simon on 03-16-2015 at 7:00 pm

With today’s ArF based lithography using 193nm wavelength light, we are hard up against the limitations imposed by the Raleigh equation. Numerous clever things have been devised to maximize yield and reduce feature size. These include 2 beam lithography, multiple patterning, immersion litho processes to improve NA, thinner… Read More


Cadence’s New Implementation System Promises Better TAT and PPA

Cadence’s New Implementation System Promises Better TAT and PPA
by Tom Simon on 03-12-2015 at 1:00 am

On Tuesday Cadence made a big announcement about their new physical implementation offering, Innovus, during the keynote address at the CDNLive event in Silicon Valley. Cadence CEO Lip-Bu Tan alluded to it during his kick off talk, and next up Anirudh Devgan, Senior Vice President, Digital & Signoff Group, filled in more … Read More


On-Chip Power Integrity Analysis Moves to the Package

On-Chip Power Integrity Analysis Moves to the Package
by Tom Simon on 03-11-2015 at 1:00 am

Power regimes for contemporary SOC’s now include a large number of voltage domains. Rail voltages are matched closely to the performance and power requirements of various portions of the design. Indeed, some of the supply voltages are so low that the noise margins in these domains is exceedingly low. Higher voltage domains are… Read More


IoT Sensor Node Designs Call for Highly Integrated Flows

IoT Sensor Node Designs Call for Highly Integrated Flows
by Tom Simon on 02-21-2015 at 7:00 pm

Applications for IoT sensors are becoming more sophisticated, especially for industrial usage. Building optimal sensors for different applications requires multi-domain design, optimization and verification flows. The sensor devices are usually MEMS, and as such have electrical properties that need to be tailored to … Read More


MEMS Require 3D Field Solver for Accurate Cap Values

MEMS Require 3D Field Solver for Accurate Cap Values
by Tom Simon on 02-18-2015 at 9:00 am

MEMS devices have become extremely important and common. Freescale last year reported its combined MEMS shipments exceeded 2 billion units. If we just examine how many accelerometers we each probably own today, it is easy to see why the market for these products is growing so rapidly. The first and most obvious device is our cell… Read More


How Well is HSPICE Tracking Current Design Trends?

How Well is HSPICE Tracking Current Design Trends?
by Tom Simon on 02-11-2015 at 10:00 pm

For about 5 years now Synopsys has held an HSPICE SIG event in conjunction with DesignCon. It features a small vendor faire with companies that partner with Synopsys on HSPICE flows. They also have a dinner with industry/customer speakers and provide an update on HSPICE development. Lastly there is a Q&A where customers get… Read More


OpenHAB Aims to Bring Open Source and Local Control to IoT?

OpenHAB Aims to Bring Open Source and Local Control to IoT?
by Tom Simon on 02-02-2015 at 7:00 pm

The predominant model for IoT sensor data flow is for data collection on the device and data storage, analysis and access in the cloud. By cloud, I mean that particular vendor’s servers. This is true for Fitbit, Nest, Dropcam,Trace Snow (my favorite skiing app), Smart Things, etc. If you look up IBM’s presumptuously named InternetRead More


Sigrity Focuses on LPDDR4 Compliance Analysis in 2015 Release

Sigrity Focuses on LPDDR4 Compliance Analysis in 2015 Release
by Tom Simon on 01-27-2015 at 10:00 am

It was back in July of 2012 that the acquisition of Sigrity by Cadence was announced. Although Cadence is a dominant player in both IC and board layout tools, they did not have an electromagnetic (EM) signal integrity solution in their portfolio. This acquisition marks a turning point for the EM/SI sector – tight integration… Read More


ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon

ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon
by Tom Simon on 01-27-2015 at 9:00 am

ANSYS makes a big deal of being a multi-physics company. Still it has taken them a while to fully integrate Apache. Nevertheless it seems like there is a compelling argument for combining technologies to solve SOC design problems. Frankly most chip designers would be hard pressed to think of a reason for using computational fluidRead More