Next week is the SPIE Advanced Lithography Conference in San Jose, the premier conference for advanced lithography used to produce state-of-the-art semiconductors. Last year I blogged after the conference about some of the key points I heard at the conference and this year I plan to do the same.
Author: Scotten Jones
Translating Intel
Some of Intel’s technology posts make some pretty specific statements and I have seen a number of posts where people seem to have misinterpreted what Intel was actually saying.
Multi Patterning
I have seen a lot of confusion on this one with some people saying Intel didn’t use multi patterning at 22nm and others saying Intel used … Read More
Ion Implant – Its Not Just for Doping Anymore
At the heart of fabricating integrated circuits is the ability to selectively change the electrical properties of the semiconductor substrate. This key to fabrication is accomplished by doping – introducing atoms locally into the semiconductor substrate.
In the early days of the semiconductor industry doping was accomplished… Read More
Apples Versus Zebras
I have seen a couple of posts comparing the density of the Apple A8 to the Intel Core M and concluding that the TSMC 20nm process is denser than the Intel 14nm process. In one of the threads one of the posters likened this to comparing apples to oranges, I agree except I think it is even worse than that, I think it is more like comparing apples… Read More
IEDM Advanced CMOS Technology Platform Session
First I want recognize that IEDM once again provided all of the attendees with the proceedings as soon as we arrived at the conference, in fact the proceeding included every year of IEDM back to 1955. This is how a conference should be run! Anyone who read my blog about the SPIE Advanced Lithography Conference will know how frustrating… Read More
Intel 2014 Investor Meeting and 14nm Status
Intel’s investor meeting was held yesterday and for me the presentation that is most interesting is Bill Holt’s. The presentations are available on the Intel website: Intel Corporation – Presentations Material 2014. Here is the 2013 version of this presentation: Intel Corporation – Presentations Materials 2013… Read More
IEDM 2014 Preview
The International Electron Devices Meeting (IEDM) is one of the premier conferences for the presentation of the latest semiconductor processes and process technologies. IEDM is held every year in December alternating between San Francisco and Washington DC. This year IEDM will be held at the San Francisco Hilton on December… Read More
Who Will Lead at 10nm?
There has been a lot of discussion on SemiWiki lately around 14nm FinFET technology and who really leads and by how much. I thought it would be interesting to review some process metrics for previous technology generation and then make some forecasts around 10nm.
The focus of this article will be Intel, TSMC and Global Foundries/Samsung… Read More
Intel Versus TSMC 14nm Processes
Intel has begun to release some details on their 14nm process. I thought it would be interesting to contrast what Intel has disclosed to TSMC’s 16nm process disclosure from last year’s IEDM (TSMC calls their 14nm process 16nm).
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The Leading Edge Foundry Landscape
There have been a lot of interesting announcements and presentations lately from the leading edge foundries. Looking at all of this information, a pretty interesting picture begins to emerge.
TSMC
TSMC is far and away the world’s largest foundry. In their 2014-Q2 conference call TSMC outlined their expectations for the balance… Read More
Next Generation of Systems Design at Siemens