Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
Author: Kalar Rajendiran
UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
Improving Wafer Quality and Yield with UPW Resistivity and TOC Measurements
An earlier SemiWiki post discussed water sustainability in semiconductor manufacturing, related challenges and solutions. Whether first time use or recycled use, water purity needs to meet certain stringent criteria for the processing task on hand. This article will look at it from a wafer quality and yield perspective and… Read More
Rugged Security Solutions For Evolving Cybersecurity Threats
Secure-IC is a global leader in end-to-end cybersecurity solutions, specializing in the domain of embedded systems and connected devices. With an unwavering commitment to pushing the boundaries of security innovation, Secure-IC has established a remarkable track record. Its credentials include active involvement in new… Read More
A Complete Guidebook for PCB Design Automation
Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More
Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability
Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More
Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
The surge in Edge AI applications has propelled the need for architectures that balance performance, power efficiency, and flexibility. Architectural choices play a pivotal role in determining the success of AI processing at the edge, with trade-offs often necessary to meet the unique demands of diverse workloads. There are… Read More
Successful 3DIC design requires an integrated approach
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems
The automotive industry is undergoing a major transformation; it is not about just connectivity and convenience anymore. Data is emerging as the driving force behind innovation and safety with vehicles becoming sophisticated data-driven machines. By unlocking the power of data, we can create safer vehicles and roads and usher… Read More
Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers
Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More
Facing the Quantum Nature of EUV Lithography