UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem

UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
by Kalar Rajendiran on 12-11-2023 at 6:00 am

Pike Creek UCIe Test chip

Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More


Improving Wafer Quality and Yield with UPW Resistivity and TOC Measurements

Improving Wafer Quality and Yield with UPW Resistivity and TOC Measurements
by Kalar Rajendiran on 12-04-2023 at 10:00 am

MT Group Stock Photo

An earlier SemiWiki post discussed water sustainability in semiconductor manufacturing, related challenges and solutions. Whether first time use or recycled use, water purity needs to meet certain stringent criteria for the processing task on hand. This article will look at it from a wafer quality and yield perspective and… Read More


Rugged Security Solutions For Evolving Cybersecurity Threats

Rugged Security Solutions For Evolving Cybersecurity Threats
by Kalar Rajendiran on 11-30-2023 at 6:00 am

Secure IC Stockphoto.jpg

Secure-IC is a global leader in end-to-end cybersecurity solutions, specializing in the domain of embedded systems and connected devices. With an unwavering commitment to pushing the boundaries of security innovation, Secure-IC has established a remarkable track record. Its credentials include active involvement in new… Read More


A Complete Guidebook for PCB Design Automation

A Complete Guidebook for PCB Design Automation
by Kalar Rajendiran on 11-29-2023 at 8:00 am

Constraint Management

Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More


Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability

Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability
by Kalar Rajendiran on 11-27-2023 at 6:00 am

Synopsys 224G SerDes IP InterOp Multiple Tradeshows

Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More


Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing

Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
by Kalar Rajendiran on 11-21-2023 at 10:00 am

CEVA Comprehensive Edge AI Portfolio

The surge in Edge AI applications has propelled the need for architectures that balance performance, power efficiency, and flexibility. Architectural choices play a pivotal role in determining the success of AI processing at the edge, with trade-offs often necessary to meet the unique demands of diverse workloads. There are… Read More


Successful 3DIC design requires an integrated approach

Successful 3DIC design requires an integrated approach
by Kalar Rajendiran on 11-13-2023 at 6:00 am

Siemens EDA 3DIC Graphics

While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More


Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems

Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems
by Kalar Rajendiran on 11-06-2023 at 10:00 am

SDVs New Monetization Opportunities

The automotive industry is undergoing a major transformation; it is not about just connectivity and convenience anymore. Data is emerging as the driving force behind innovation and safety with vehicles becoming sophisticated data-driven machines. By unlocking the power of data, we can create safer vehicles and roads and usher… Read More


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers

100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers
by Kalar Rajendiran on 10-23-2023 at 6:00 am

112G Ethernet PHY IP EOE InterOp Demo JR5 0179

Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More