The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More
Author: Kalar Rajendiran
Driving the Future of HPC Through 224G Ethernet IP
Emerging Stronger from the Downturn
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
Chiplet Modeling and Workflow Standardization Through CDX
Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More
Alchip is Golden, Keeps Breaking Records on Multiple KPIs
I don’t know the story behind the name Alchip. I’ve been asking this question ever since its founding in 2003 and still haven’t found the answer. Wikipedia sometimes provides insights and stories behind names of companies, products and services but I couldn’t find any regarding the name Alchip. One thing is for sure. After its consistent… Read More
Tessent SSN Enables Significant Test Time Savings for SoC ATPG
SoC test challenges arise due to the complexity and diversity of the functional blocks integrated into the chip. As SoCs become more complex, it becomes increasingly difficult to access all of the functional blocks within the chip for testing. SoCs also can contain billions of transistors, making it extremely time-consuming… Read More
Memory Solutions for Modem, EdgeAI, Smart IoT and Wearables Applications
Memories have always played a critical role, both in pushing the envelope on the semiconductor process development front and supporting the varied requirements of different applications and use-cases. The list of the various types of memories in use today runs long. At a gross level, we can classify memories into volatile or … Read More
Achieving Optimal PPA at Placement and Carrying it Through to Signoff
Performance, Power and Area (PPA) metrics are the driving force in the semiconductor market and impact all electronic products that are developed. PPA tradeoff decisions are not engineering decisions, but rather business decisions made by product companies as they decide to enter target end markets. As such, the sooner a company… Read More
How to Enable High-Performance VLSI Engineering Environments
Very Large Scale Integration (VLSI) engineering organizations are known for their intricate workflows that require high-performance simulation software and an abundance of simulation licenses to create cutting-edge chips. These workflows involve complex dependency trees, where one task depends on the completion of another… Read More
Synopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC
Banias Labs is a semiconductor company that develops infrastructure solutions for next-generation communications. Its target market is the high-performance computing infrastructure market including hyperscale data center, networking, AI, optical module, and Ethernet switch SoCs for emerging high-performance computing… Read More
Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links
As digital transmission speeds increase, designers use various techniques to improve the signal-to-noise ratio at the receiver output. One such technique is the Decision Feedback Equalizer (DFE) scheme, commonly used in high-speed Serializer-Deserializer (SerDes) circuits to mitigate the effects of channel noise and … Read More
CHIPS Act dies because employees are fired – NIST CHIPS people are probationary