The future market performance for an IP vendor licensing an IP based on a model with upfront fee plus royalties can be easily and safely evaluated if you look at the first part of revenue: upfront fee. Even if the royalty part is declining, exhibiting a 52% increase (Q4 2013 to Q4 2012) in upfront licensing fee is a promise that the future… Read More
Author: Eric Esteve
Who needs DDR4 PHY running at 2667 Mbps?
As of today, DDR4 are targeting server, networking and consumer applications, and it will take another year before we use DDR4 equipped PC at home. In fact, a majority of consumers will rather buy a smartphone or tablet than a PC, most of these devices coming with PLDDR2 and only a few high-end tablets are equipped with LPDDR3 memory.… Read More
Getting the best from MIPI IP Toolbox
The set of MIPI specifications has severely enlarged during the past year. This is a positive point, as the large set of specifications induces a wider choice, and a chip maker can decide to implement a complex specification to differentiate with competitors, or select a specification just tailored to support a basic architecture… Read More
SilabTech Awarded 2013 Best Start-up in India
This is obviously great news for SilabTech, and this is the type of news which will change the perception that we (non-Indian) have of the Semiconductor industry in India. About 15-20 years ago, the India Embedded/VLSI industry was perceived as low cost design resource pool, a good place where to implement design center. The hidden… Read More
MIPI Alliance Specifications Adoption Status in 2013
At the beginning of December in Paris I had the opportunity to make a presentation to a very impressive audience, technical gurus from companies contributing to MIPI Alliance specification were here, including ST-Microelectronics, Intel, Qualcomm, TI, Toshiba, Nokia, Samsung, to name a few. … Read More
Why SOI is the Future Technology of Semiconductor
No doubt that FDSOI generate high interest these days and I found a very interesting contribution from Zvi Or-Bach, President and CEO of MonolithIC 3D, Inc. Zvi has accepted to share his wrap-up from IEDM, in a blog for Semiwiki readers. If you remember the long discussion we had in Semiwiki about cost comparison, some comments were… Read More
UTBB FDSOI Devices Featuring 20nm Gate Length
Did you go to IEDM 2013 in Washington DC ? You may have attended to the “Advanced CMOS Technology Platform” chaired by TSMC, and listen to the FD-SOI related presentation “High Performance UTBB FDSOI Devices Featuring 20nm Gate Length for 14nm Node and Beyond”. According with the abstract, this paper is the first time report of “high… Read More
OpenVX Bring Power-efficient Vision Acceleration to Mobile
OpenVX is the next open source sample specification to be launched by Khronos group, a consortium building a family of interoperating APIs for portable and power efficient vision processing. If you take a look at the OpenVX participant list, you can check that the major chip makers: Broadcom, Qualcomm, TI, Intel, Nvidia, Renesas,… Read More
Complete IP port-folio built in less than two years!
We have posted several blogs related to Cadence IP strategy, or I should say new strategy. Each of these blogs was dealing with a particular product, like PCI Express gen-3 Controller IP, latest DDR4 Memory Controller or Wide I/O. This approach was equivalent to describe trees, one after one, and finally ignoring the forest! It’s… Read More
Why integrating HDMI 2.0?
High Definition Multimedia Interface (HDMI) is today part of our day to day life, at home as well as at our office we are using devices integrating HDMI ports. HDMI penetration is well illustrated by this picture (created in Dec. 2011 by In-Stat): from DTV to Game console, the devices belong to the Consumer Electronics market segments,… Read More
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